A semiconductor module includes at least two semiconductor elements connected in parallel; a control circuit board placed between the at least two semiconductor elements; a control terminal for external connection; a first wiring member that connects the control terminal and the control circuit board; and a second wiring member that connects a control electrode of one of the at least two semiconductor elements and the control circuit board, wherein the second wiring member is wire-bonded from the control electrode towards the control circuit board, and has a first end on the control electrode and a second end on the control circuit board, the first end having a cut end face facing upward normal to a surface of the control electrode and the second end having a cut end face facing sideways parallel to a surface of the control circuit board.

Provided is a power semiconductor module that can secure insulating properties. A semiconductor element is mounted on a resin-insulated base plate including a circuit pattern, a resin insulating layer, and a base plate. A case enclosing the resin-insulated base plate is bonded to the resin insulating layer with an adhesive. The resin insulating layer and the case are bonded together with a region enclosed by the resin insulating layer and a tapered portion of the case formed closer to the resin insulating layer being filled with the adhesive made of a material identical to that of the sealing resin. Air bubbles in the adhesive appear in the tapered portion opposite to the resin insulating layer.

Provided is a power semiconductor module that can secure insulating properties. A semiconductor element is mounted on a resin-insulated base plate including a circuit pattern, a resin insulating layer, and a base plate. A case enclosing the resin-insulated base plate is bonded to the resin insulating layer with an adhesive. The resin insulating layer and the case are bonded together with a region enclosed by the resin insulating layer and a tapered portion of the case formed closer to the resin insulating layer being filled with the adhesive made of a material identical to that of the sealing resin. Air bubbles in the adhesive appear in the tapered portion opposite to the resin insulating layer.

A semiconductor package includes a package substrate including an insulating layer having an upper surface and a lower surface and provided with a first region which is recessed to a first depth from the upper surface toward the lower surface, a redistribution wiring buried in the insulating layer, a chip connection pad on a bottom surface of the recessed first region and connected to the redistribution wiring, and a wire connection pad on the upper surface of the insulating layer and connected to the redistribution wiring, a first semiconductor chip overlapping, in a top-down view of the semiconductor package, the recessed first region of the insulating layer and comprising a first chip pad connected to the chip connection pad of the package substrate, and a second semiconductor chip on the first semiconductor chip and connected to the wire connection pad of the package substrate through a conductive wire.

A semiconductor package includes a package substrate including an insulating layer having an upper surface and a lower surface and provided with a first region which is recessed to a first depth from the upper surface toward the lower surface, a redistribution wiring buried in the insulating layer, a chip connection pad on a bottom surface of the recessed first region and connected to the redistribution wiring, and a wire connection pad on the upper surface of the insulating layer and connected to the redistribution wiring, a first semiconductor chip overlapping, in a top-down view of the semiconductor package, the recessed first region of the insulating layer and comprising a first chip pad connected to the chip connection pad of the package substrate, and a second semiconductor chip on the first semiconductor chip and connected to the wire connection pad of the package substrate through a conductive wire.

A semiconductor package of the present invention comprises a base plate, an insulating substrate, and a lead frame, wherein the base plate is made of a metallic material including Cu and Be—Cu. The present invention can ensure bonding reliability and thus prevent performance degradation of semiconductor devices.

A semiconductor package of the present invention comprises a base plate, an insulating substrate, and a lead frame, wherein the base plate is made of a metallic material including Cu and Be—Cu. The present invention can ensure bonding reliability and thus prevent performance degradation of semiconductor devices.

A semiconductor memory device includes first memory dies stacked one upon another and electrically connected one to another by first bond wires, and covered with a first encapsulant. Second memory dies are disposed above the first memory dies, stacked one upon another and electrically connected one to another with second bond wires, and covered with a second encapsulant. A control die may be mounted on the top die in the second die stack. Vertical bond wires extend between the stacked die modules. A redistribution layer is formed over the top die stack and the control die to allow for electrical communication with the memory device. The memory device allows for stacking memory dies in a manner that allows for increased memory capacity without increasing the package form factor.

A semiconductor memory device includes first memory dies stacked one upon another and electrically connected one to another by first bond wires, and covered with a first encapsulant. Second memory dies are disposed above the first memory dies, stacked one upon another and electrically connected one to another with second bond wires, and covered with a second encapsulant. A control die may be mounted on the top die in the second die stack. Vertical bond wires extend between the stacked die modules. A redistribution layer is formed over the top die stack and the control die to allow for electrical communication with the memory device. The memory device allows for stacking memory dies in a manner that allows for increased memory capacity without increasing the package form factor.

The present disclosure provides an electronic package. The electronic package includes a substrate, a first electronic component, an encapsulant, and a shielding layer. The substrate has a first upper surface, a second upper surface, and a first lateral surface extending between the first upper surface and the second upper surface. The first electronic component is disposed on the substrate. The encapsulant coves the first electronic component and the first lateral surface of the substrate. The shielding layer covers the encapsulant. The shielding layer is spaced apart from the first lateral surface of the substrate.