A semiconductor package having an aperture in a die pad and solder in the aperture coplanar with a surface of the package is disclosed. The package includes a die pad, a plurality of leads, and a semiconductor die coupled to the die pad with a die attach material. A cavity or aperture is formed through the die pad to expose a portion of the die attach material. Multiple solder reflows are performed to reduce the presence of voids in the die attach material. In a first solder reflow, the voids of trapped gas that form when attaching the die to the die pad are released. Then, in a second solder reflow, solder is added to the aperture coplanar with a surface of the die pad. The additional solder can be the same material as the die attach material or a different material.

A semiconductor package having an aperture in a die pad and solder in the aperture coplanar with a surface of the package is disclosed. The package includes a die pad, a plurality of leads, and a semiconductor die coupled to the die pad with a die attach material. A cavity or aperture is formed through the die pad to expose a portion of the die attach material. Multiple solder reflows are performed to reduce the presence of voids in the die attach material. In a first solder reflow, the voids of trapped gas that form when attaching the die to the die pad are released. Then, in a second solder reflow, solder is added to the aperture coplanar with a surface of the die pad. The additional solder can be the same material as the die attach material or a different material.

A semiconductor package having an aperture in a die pad and solder in the aperture coplanar with a surface of the package is disclosed. The package includes a die pad, a plurality of leads, and a semiconductor die coupled to the die pad with a die attach material. A cavity or aperture is formed through the die pad to expose a portion of the die attach material. Multiple solder reflows are performed to reduce the presence of voids in the die attach material. In a first solder reflow, the voids of trapped gas that form when attaching the die to the die pad are released. Then, in a second solder reflow, solder is added to the aperture coplanar with a surface of the die pad. The additional solder can be the same material as the die attach material or a different material.

A semiconductor package having an aperture in a die pad and solder in the aperture coplanar with a surface of the package is disclosed. The package includes a die pad, a plurality of leads, and a semiconductor die coupled to the die pad with a die attach material. A cavity or aperture is formed through the die pad to expose a portion of the die attach material. Multiple solder reflows are performed to reduce the presence of voids in the die attach material. In a first solder reflow, the voids of trapped gas that form when attaching the die to the die pad are released. Then, in a second solder reflow, solder is added to the aperture coplanar with a surface of the die pad. The additional solder can be the same material as the die attach material or a different material.

An integrated circuit package with improved reliability and methods for creating the same are disclosed. More specifically, integrated circuit packages are created using one or more sacrificial layers that provide support for ink printed wires prior to package processing, but are removed during package processing. Once each of the sacrificial layers is removed, molding compound is placed around each ink printed wire, which may have a substantially rectangular cross section that can vary in dimension along a length of a given wire. While substantially surrounding each wire in and of itself improves reliability, removing non-conductive paste, fillets, or other adhesive materials also minimizes adhesion issues between the molding compound and those materials, which increases the bond of the molding compound to the package and its components. The net result is a more reliable integrated circuit package that is less susceptible to internal cracking and wire damage.

An integrated circuit package with improved reliability and methods for creating the same are disclosed. More specifically, integrated circuit packages are created using one or more sacrificial layers that provide support for ink printed wires prior to package processing, but are removed during package processing. Once each of the sacrificial layers is removed, molding compound is placed around each ink printed wire, which may have a substantially rectangular cross section that can vary in dimension along a length of a given wire. While substantially surrounding each wire in and of itself improves reliability, removing non-conductive paste, fillets, or other adhesive materials also minimizes adhesion issues between the molding compound and those materials, which increases the bond of the molding compound to the package and its components. The net result is a more reliable integrated circuit package that is less susceptible to internal cracking and wire damage.

An integrated circuit package with improved reliability and methods for creating the same are disclosed. More specifically, integrated circuit packages are created using one or more sacrificial layers that provide support for ink printed wires prior to package processing, but are removed during package processing. Once each of the sacrificial layers is removed, molding compound is placed around each ink printed wire, which may have a substantially rectangular cross section that can vary in dimension along a length of a given wire. While substantially surrounding each wire in and of itself improves reliability, removing non-conductive paste, fillets, or other adhesive materials also minimizes adhesion issues between the molding compound and those materials, which increases the bond of the molding compound to the package and its components. The net result is a more reliable integrated circuit package that is less susceptible to internal cracking and wire damage.

An integrated circuit package with improved reliability and methods for creating the same are disclosed. More specifically, integrated circuit packages are created using one or more sacrificial layers that provide support for ink printed wires prior to package processing, but are removed during package processing. Once each of the sacrificial layers is removed, molding compound is placed around each ink printed wire, which may have a substantially rectangular cross section that can vary in dimension along a length of a given wire. While substantially surrounding each wire in and of itself improves reliability, removing non-conductive paste, fillets, or other adhesive materials also minimizes adhesion issues between the molding compound and those materials, which increases the bond of the molding compound to the package and its components. The net result is a more reliable integrated circuit package that is less susceptible to internal cracking and wire damage.

A bond wire has an outer layer formed of a conductive material and a core formed of a non-conductive material. The non-conductive material is blended with conductive fillers to enhance electrical and/or thermal conductivity characteristics of the bond wire.

An integrated circuit package with improved reliability and methods for creating the same are disclosed. More specifically, integrated circuit packages are created using one or more sacrificial layers that provide support for ink printed wires prior to package processing, but are removed during package processing. Once each of the sacrificial layers is removed, molding compound is placed around each ink printed wire, which may have a substantially rectangular cross section that can vary in dimension along a length of a given wire. While substantially surrounding each wire in and of itself improves reliability, removing non-conductive paste, fillets, or other adhesive materials also minimizes adhesion issues between the molding compound and those materials, which increases the bond of the molding compound to the package and its components. The net result is a more reliable integrated circuit package that is less susceptible to internal cracking and wire damage.