Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/42
Wire connectors; Manufacturing methods related thereto
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H01L2224/44
Structure, shape, material or disposition of the wire connectors prior to the connecting process
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H01L2224/45
of an individual wire connector
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H01L2224/45001
Core members of the connector
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H01L2224/45198
with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
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H01L2224/45393
with a principal constituent of the material being a solid not provided for in groups H01L2224/453 - H01L2224/45391, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
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H01L2224/45393

BOND WIRE HAVING A RECYCLED THERMOPLASTIC CORE WITH CONDUCTIVE FILLERS
20240404980 · 2024-12-05 ·

A bond wire has an outer layer formed of a conductive material and a core formed of a non-conductive material. The non-conductive material is blended with conductive fillers to enhance electrical and/or thermal conductivity characteristics of the bond wire.