Patent classifications
H
ELECTRICITY
Load children
H01
ELECTRIC ELEMENTS
Load children
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
Load children
2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/42
Wire connectors; Manufacturing methods related thereto
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/47
Structure, shape, material or disposition of the wire connectors after the connecting process
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/48
of an individual wire connector
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/48799
Principal constituent of the connecting portion of the wire connector being Copper (Cu)
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/48893
with a principal constituent of the bonding area being a solid not provided for in groups H01L2224/488 - H01L2224/4889, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
Filter patents View analytics View as hierarchy Open in page

H01L2224/48893

Package-On-Package (PoP) Structure Including Stud Bulbs and Method
20170025391 · 2017-01-26 ·

Embodiments concern Package-On-Package (PoP) structures including stud bulbs and methods of forming PoP structures. According to an embodiment, a structure includes a first substrate, stud bulbs, a die, a second substrate, and electrical connectors. The stud bulbs are coupled to a first surface of the first substrate. The die is attached to the first surface of the first substrate. The electrical connectors are coupled to the second substrate, and respective ones of the electrical connectors are coupled to respective ones of the stud bulbs.

Package-On-Package (PoP) Structure Including Stud Bulbs and Method
20170025391 · 2017-01-26 ·

Embodiments concern Package-On-Package (PoP) structures including stud bulbs and methods of forming PoP structures. According to an embodiment, a structure includes a first substrate, stud bulbs, a die, a second substrate, and electrical connectors. The stud bulbs are coupled to a first surface of the first substrate. The die is attached to the first surface of the first substrate. The electrical connectors are coupled to the second substrate, and respective ones of the electrical connectors are coupled to respective ones of the stud bulbs.