The invention relates to a method (110) for producing an electrically conductive connection (112, 112′) on a substrate (114), comprising the following steps: a) providing a substrate (114), wherein the substrate (114) is configured for receiving an electrically conductive connection (112, 112′); b) providing a reservoir of an electrically conductive liquid alloy, wherein the reservoir has a surface at which the alloy has an insulating layer; c) providing a capillary (120) configured for taking up the electrically conductive liquid alloy; d) penetrating of a tip (122) of the capillary (120) under the surface of the reservoir and taking up of a portion of the alloy from the reservoir; and e) applying the portion of the alloy at least partly to the substrate (114) in such a manner that an electrically conductive connection (112, 112′) is formed from the alloy on the substrate (114), wherein the alloy remains on the substrate (114) by adhesion.

The invention furthermore relates to a method for producing a microelectronic device (124) and to a microelectronic device (124), in particular a transistor (130).

Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.

The invention relates to a method (110) for producing an electrically conductive connection (112, 112) on a substrate (114), comprising the following steps: a) providing a substrate (114), wherein the substrate (114) is configured for receiving an electrically conductive connection (112, 112); b) providing a reservoir of an electrically conductive liquid alloy, wherein the reservoir has a surface at which the alloy has an insulating layer; c) providing a capillary (120) configured for taking up the electrically conductive liquid alloy; d) penetrating of a tip (122) of the capillary (120) under the surface of the reservoir and taking up of a portion of the alloy from the reservoir; and e) applying the portion of the alloy at least partly to the substrate (114) in such a manner that an electrically conductive connection (112, 112) is formed from the alloy on the substrate (114), wherein the alloy remains on the substrate (114) by adhesion. The invention furthermore relates to a method for producing a microelectronic device (124) and to a microelectronic device (124), in particular a transistor (130).

Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.