A semiconductor device includes a semiconductor chip having an electrode pad, a terminal having a terminal pad, and a bonding wire. The bonding wire includes a first end portion, a first bonded portion bonded to the electrode pad, a loop portion extending between the semiconductor chip and the terminal, and a second bonded portion bonded to the terminal pad. The second bonded portion is a wedge bonded portion comprising a second end portion of the bonding wire opposite to the first end portion. A length of the first bonded portion in the first direction is greater than a length of the second bonded portion in the first direction.

A semiconductor device includes a semiconductor chip having an electrode pad, a terminal having a terminal pad, and a bonding wire. The bonding wire includes a first end portion, a first bonded portion bonded to the electrode pad, a loop portion extending between the semiconductor chip and the terminal, and a second bonded portion bonded to the terminal pad. The second bonded portion is a wedge bonded portion comprising a second end portion of the bonding wire opposite to the first end portion. A length of the first bonded portion in the first direction is greater than a length of the second bonded portion in the first direction.

A semiconductor device including a package substrate having, at the periphery of the main surface thereof, bonding leads disposed in a row, a semiconductor chip mounted inside of the row of the bonding leads on the main surface of the package substrate, wires for connecting pads of the semiconductor chip and the bonding leads of the substrate, a sealing body for resin sealing the semiconductor chip and the wires, and solder bumps disposed on the back surface of the package substrate. The top of a loop of each of the wires is disposed outside the wire connecting portion so that the wire connection between the bonding leads and the pads of the semiconductor chip has a stable loop shape to prevent wire connection failure.

A semiconductor device including a package substrate having, at the periphery of the main surface thereof, bonding leads disposed in a row, a semiconductor chip mounted inside of the row of the bonding leads on the main surface of the package substrate, wires for connecting pads of the semiconductor chip and the bonding leads of the substrate, a sealing body for resin sealing the semiconductor chip and the wires, and solder bumps disposed on the back surface of the package substrate. The top of a loop of each of the wires is disposed outside the wire connecting portion so that the wire connection between the bonding leads and the pads of the semiconductor chip has a stable loop shape to prevent wire connection failure.

A semiconductor device including a package substrate having, at the periphery of the main surface thereof, bonding leads disposed in a row, a semiconductor chip mounted inside of the row of the bonding leads on the main surface of the package substrate, wires for connecting pads of the semiconductor chip and the bonding leads of the substrate, a sealing body for resin sealing the semiconductor chip and the wires, and solder bumps disposed on the back surface of the package substrate. The top of a loop of each of the wires is disposed outside the wire connecting portion so that the wire connection between the bonding leads and the pads of the semiconductor chip has a stable loop shape to prevent wire connection failure.