A multifaceted capillary that can be used in a wire-bonding machine to create a multi-segment wire-bond is disclosed. The multifaceted capillary is shaped to apply added pressure and thickness to an outer segment of the multi-segment wire-bond that is closest to the wire loop. The added pressure eliminates a gap under a heel portion of the multi-segment wire-bond and the added thickness increases a mechanical strength of the heel portion. As a result, a pull test of the multi-segment wire-bond may be higher than a single-segment wire-bond and the multi-segment wire-bond may resist cracking, lifting, or breaking.

A method for calibrating a second bonding machine based on a calibrated first bonding machine is disclosed. The first bonding machine includes a first ultrasonic transducer. The second bonding machine includes a second ultrasonic transducer and a power supply. The method includes providing a first electrical calibration supply that causes the first ultrasonic transducer to oscillate at a first calibration amplitude when it is damped by a mechanical damping, providing a second electrical calibration supply that causes the second ultrasonic transducer to oscillate at the same calibration amplitude when it is damped by the same mechanical damping. The second bonding machine is adapted to modify a second control signal based on a first electrical parameter of the first electrical calibration supply and on a second electrical parameter of the second electrical calibration supply in order to generate a modified second control signal, provide the modified second control signal to the power supply in order to cause the second power supply to generate a second electrical supply, and provide the second electrical supply to the second ultrasonic transducer.

A method of calibrating an ultrasonic characteristic on a wire bonding system is provided. The method includes the steps of: (a) determining a reference ultrasonic characteristic for formation of a wire bond; (b) determining a reference non-stick ultrasonic characteristic that results in a non-stick wire bond condition; (c) determining a calibration non-stick ultrasonic characteristic, on a wire bonding system to be calibrated, that results in a non-stick wire bond condition; and (d) determining a calibration factor for the wire bonding system to be calibrated using the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.

A multifaceted capillary that can be used in a wire-bonding machine to create a multi-segment wire-bond is disclosed. The multifaceted capillary is shaped to apply added pressure and thickness to an outer segment of the multi-segment wire-bond that is closest to the wire loop. The added pressure eliminates a gap under a heel portion of the multi-segment wire-bond and the added thickness increases a mechanical strength of the heel portion. As a result, a pull test of the multi-segment wire-bond may be higher than a single-segment wire-bond and the multi-segment wire-bond may resist cracking, lifting, or breaking.

Provided is a wire-bonding apparatus (10) including: a capillary (28) through which a wire (30) inserted; and a controller (80). The controller (80) is configured to execute operations including: a disconnection operation, after the second bonding operation, of moving the capillary through which the wire is inserted within a horizontal plane vertical to an axial direction of the capillary while the wire is held in the clamped state, and thereby disconnecting the wire from the second bonding point; a preliminary bonding operation of feeding the wire from the second bonding point to a predetermined preliminary bonding point, and performing preliminary bonding at the preliminary bonding point; and a shaping operation, after the preliminary bonding operation, of shaping the wire projecting from a tip of the capillary into a predetermined flexed shape.

A method for fabricating a semiconductor device includes providing a semiconductor die, arranging an electrical connector over the semiconductor die, the electrical connector including a conductive core, an absorbing feature arranged on a first side of the conductive core, and a solder layer arranged on a second side of the conductive core, opposite the first side and facing the semiconductor die, and soldering the electrical connector onto the semiconductor die by heating the solder layer with a laser, wherein the laser irradiates the absorbing feature and absorbed energy is transferred from the absorbing feature through the conductive core to the solder layer.

A bonding apparatus has a bonding tool for bonding a wire to a bonding surface, a bonding tool retainer configured to releasably retain the bonding tool, a bonding tool holder configured to hold at least one bonding tool, a bonding tool manipulator configured to transfer said bonding tool between said bonding tool holder and said bonding tool retainer, and a bonding tool guide configured to guide said bonding tool to be received by said bonding tool retainer during transfer by said bonding tool manipulator.

A bonding arrangement comprising a bonding tool, having a tool shank which is designed to extend in a longitudinal direction of the tool, and a tool tip which connects to the tool shank. A first end side of the bonding tool is provided on the tool tip, which is designed to come into contact with a connection part. A second end side of the bonding tool is provided on the tool shank. The bonding tool has a casing surface connecting the first end side and the second end side, said bonding arrangement comprising a laser generator for providing a laser beam and comprising a light guide designed to guide the laser beam to the bonding tool. A functional recess is formed on the bonding tool on the casing side and the light guide is associated with the bonding too on the casing side from the outside and at a distance.

A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to a position above the wire bond; (c) moving the wire bonding tool to contact the length of wire, at a position along the length of wire, to partially sever the length of wire at the position along the length of wire; and (d) separating the length of wire from a wire supply at the position along the length of wire, thereby providing a wire interconnect structure bonded to the bonding location.

A method of detecting potential issues in connection with engagement between a wire bonding tool and an ultrasonic transducer of a wire bonding machine is provided. The method includes the steps of: (a) providing electrical power to an ultrasonic transducer at each of a plurality of levels of electrical power; (b) detecting an electrical characteristic of the ultrasonic transducer at each of the plurality of levels of electrical power; and (c) determining if the electrical characteristic of the ultrasonic transducer at each of the plurality of levels of electrical power is acceptable.