Patent classifications
H
H01
H01L
2224/00
H01L2224/80
H01L2224/81
H01L2224/8138
H01L2224/81399
H01L2224/81498
H01L2224/81598
H01L2224/81599
H01L2224/81695
H01L2224/81695
Interconnect using embedded carbon nanofibers
Embodiments relate to the design of a device capable of increasing the electrical performance of an interconnect feature by amplifying the current carrying capacity of an interconnect feature. The device comprises a first body comprising a first surface with at least one nanoporous conductive structure protruding from the first surface. The device further comprises a second body comprising a second surface with arrays of nanofibers extending from the second surface and penetrating into corresponding nanoporous conductive structures to form conductive pathways between the first body and the second body.