Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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H01L2224/82
by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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H01L2224/8234
Bonding interfaces of the connector
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H01L2224/82355
having an external coating, e.g. protective bond-through coating
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H01L2224/82355

Semiconductor package with semiconductor die directly attached to lead frame and method
09711484 · 2017-07-18 · ·

In one embodiment, a semiconductor package includes a semiconductor die having conductive pads. A lead frame is directly connected to the conductive pads using an electrochemically formed layer or a conductive adhesive layer thereby facilitating an electrical connection between the conductive pads of the semiconductor die and the lead frame without using separate wire bonds or conductive bumps.