Patent classifications
H
ELECTRICITY
Load children
H01
ELECTRIC ELEMENTS
Load children
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
Load children
2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/80
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/82
by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/8285
using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/82855
Hardening the adhesive by curing, i.e. thermosetting
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/82871
Visible light curing
Filter patents View analytics View as hierarchy Open in page

H01L2224/82871

Selective Soldering with Photonic Soldering Technology
20210185831 · 2021-06-17 ·

Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

Selective Soldering with Photonic Soldering Technology
20210043597 · 2021-02-11 ·

Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

Selective soldering with photonic soldering technology
12041728 · 2024-07-16 · ·

Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.