An electronic device and a method for producing an electronic device are disclosed. In an embodiment the electronic device includes a first component and a second component and a sinter layer connecting the first component to the second component, the sinter layer comprising a first metal, wherein at least one of the components comprises at least one contact layer which is arranged in direct contact with the sinter layer, which comprises a second metal different from the first metal and which is free of gold.

An electronic device and a method for producing an electronic device are disclosed. In an embodiment the electronic device includes a first component and a second component and a sinter layer connecting the first component to the second component, the sinter layer comprising a first metal, wherein at least one of the components comprises at least one contact layer which is arranged in direct contact with the sinter layer, which comprises a second metal different from the first metal and which is free of gold.

One aspect of the invention is a method of manufacturing a connection structure, including disposing an adhesive layer between a first electronic member including a first substrate and a first electrode formed on the first substrate and a second electronic member including a second substrate and a second electrode formed on the second substrate, and pressure-bonding the first electronic member and the second electronic member via the adhesive layer such that the first electrode and the second electrode are electrically connected to each other, wherein the first electronic member further including an insulating layer formed on a side of the first electrode opposite to the first substrate, and the adhesive layer including: a first conductive particle being a dendritic conductive particle; and a second conductive particle being a conductive particle other than the first conductive particle and having a non-conductive core and a conductive layer provided on the core.

One aspect of the invention is a method of manufacturing a connection structure, including disposing an adhesive layer between a first electronic member including a first substrate and a first electrode formed on the first substrate and a second electronic member including a second substrate and a second electrode formed on the second substrate, and pressure-bonding the first electronic member and the second electronic member via the adhesive layer such that the first electrode and the second electrode are electrically connected to each other, wherein the first electronic member further including an insulating layer formed on a side of the first electrode opposite to the first substrate, and the adhesive layer including: a first conductive particle being a dendritic conductive particle; and a second conductive particle being a conductive particle other than the first conductive particle and having a non-conductive core and a conductive layer provided on the core.

Embodiments of the disclosure relate to flexible electronic substrates for placement on an external surface of a vehicle motor assembly. In one embodiment, a motor assembly includes a motor comprising an external surface and one or more electronic assemblies positioned on the external surface of the motor. Each electronic assembly includes a metal substrate disposed on the external surface of the motor, a dielectric layer disposed on the metal substrate, a flexible metal base layer disposed on the dielectric layer, a bonding layer disposed on the flexible metal base layer, and one or more electronic devices disposed on the bonding layer. The bonding layer bonds the one or more electronic devices to the flexible metal base layer.

Embodiments of the disclosure relate to flexible electronic substrates for placement on an external surface of a vehicle motor assembly. In one embodiment, a motor assembly includes a motor comprising an external surface and one or more electronic assemblies positioned on the external surface of the motor. Each electronic assembly includes a metal substrate disposed on the external surface of the motor, a dielectric layer disposed on the metal substrate, a flexible metal base layer disposed on the dielectric layer, a bonding layer disposed on the flexible metal base layer, and one or more electronic devices disposed on the bonding layer. The bonding layer bonds the one or more electronic devices to the flexible metal base layer.

Embodiments of the disclosure relate to flexible electronic substrates for placement on an external surface of a vehicle motor assembly. In one embodiment, a motor assembly includes a motor comprising an external surface and one or more electronic assemblies positioned on the external surface of the motor. Each electronic assembly includes a metal substrate disposed on the external surface of the motor, a dielectric layer disposed on the metal substrate, a flexible metal base layer disposed on the dielectric layer, a bonding layer disposed on the flexible metal base layer, and one or more electronic devices disposed on the bonding layer. The bonding layer bonds the one or more electronic devices to the flexible metal base layer.

Embodiments of the disclosure relate to flexible electronic substrates for placement on an external surface of a vehicle motor assembly. In one embodiment, a motor assembly includes a motor comprising an external surface and one or more electronic assemblies positioned on the external surface of the motor. Each electronic assembly includes a metal substrate disposed on the external surface of the motor, a dielectric layer disposed on the metal substrate, a flexible metal base layer disposed on the dielectric layer, a bonding layer disposed on the flexible metal base layer, and one or more electronic devices disposed on the bonding layer. The bonding layer bonds the one or more electronic devices to the flexible metal base layer.

One aspect of the invention is a method of manufacturing a connection structure, including disposing an adhesive layer between a first electronic member including a first substrate and a first electrode formed on the first substrate and a second electronic member including a second substrate and a second electrode formed on the second substrate, and pressure-bonding the first electronic member and the second electronic member via the adhesive layer such that the first electrode and the second electrode are electrically connected to each other, wherein the first electronic member further including an insulating layer formed on a side of the first electrode opposite to the first substrate, and the adhesive layer including: a first conductive particle being a dendritic conductive particle; and a second conductive particle being a conductive particle other than the first conductive particle and having a non-conductive core and a conductive layer provided on the core.

One aspect of the invention is a method of manufacturing a connection structure, including disposing an adhesive layer between a first electronic member including a first substrate and a first electrode formed on the first substrate and a second electronic member including a second substrate and a second electrode formed on the second substrate, and pressure-bonding the first electronic member and the second electronic member via the adhesive layer such that the first electrode and the second electrode are electrically connected to each other, wherein the first electronic member further including an insulating layer formed on a side of the first electrode opposite to the first substrate, and the adhesive layer including: a first conductive particle being a dendritic conductive particle; and a second conductive particle being a conductive particle other than the first conductive particle and having a non-conductive core and a conductive layer provided on the core.