H
ELECTRICITY
H
ELECTRICITY
H01
ELECTRIC ELEMENTS
H01
ELECTRIC ELEMENTS
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/80
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/80
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/83
using a layer connector
H01L2224/83
using a layer connector
H01L2224/838
Bonding techniques
H01L2224/838
Bonding techniques
H01L2224/8385
using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
H01L2224/8385
using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
H01L2224/83855
Hardening the adhesive by curing, i.e. thermosetting
H01L2224/83855
Hardening the adhesive by curing, i.e. thermosetting
H01L2224/83856
Pre-cured adhesive, i.e. B-stage adhesive
H01L2224/83856
Pre-cured adhesive, i.e. B-stage adhesive