Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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H01L2224/83909
Post-treatment of the layer connector or bonding area
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H01L2224/83935
by heating means, e.g. reflowing
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H01L2224/83945
using a corona discharge, e.g. electronic flame off [EFO]
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H01L2224/83945

Silicon carbide devices and methods for manufacturing the same
11282805 · 2022-03-22 · ·

A semiconductor device includes a silicon carbide layer, a metal carbide layer arranged over the silicon carbide layer, and a solder layer arranged over and in contact with the metal carbide layer.

Silicon Carbide Devices and Methods for Manufacturing the Same
20190295981 · 2019-09-26 ·

A semiconductor device includes a silicon carbide layer, a metal carbide layer arranged over the silicon carbide layer, and a solder layer arranged over and in contact with the metal carbide layer.