Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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H01L2224/84909
Post-treatment of the connector or bonding area
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H01L2224/8493
Reshaping, e.g. for severing the strap, modifying the loop shape
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H01L2224/84935
by heating means, e.g. reflowing
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H01L2224/84939

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICONDUCTOR DEVICE AND RIBBON FOR USE THEREIN
20230114535 · 2023-04-13 · ·

A semiconductor die and an electrically conductive ribbon are arranged on a substrate. The electrically conductive ribbon includes a roughened surface. An insulating encapsulation is molded onto the semiconductor die and the electrically conductive ribbon. The roughened surface of the electrically conductive ribbon provides a roughened coupling interface to the insulating encapsulation.

CLIP INTERCONNECT WITH MICRO CONTACT HEADS
20220181290 · 2022-06-09 · ·

A furcated clip includes a removable collar, and an arrangement of stems attached to the removable collar. The stems are configured for contacting bond pads of a semiconductor die and connecting the bond pads to leadframe posts of a leadframe structure.