A semiconductor device includes a substrate, a conductive part, a controller module and a sealing resin. The substrate has a substrate obverse surface and a substrate reverse surface facing away from each other in a z direction. The conductive part is made of an electrically conductive material on the substrate obverse surface. The controller module is disposed on the substrate obverse surface and electrically connected to the conductive part. The sealing resin covers the controller module and at least a portion of the substrate. The conductive part includes an overlapping wiring trace having an overlapping portion overlapping with the electronic component as viewed in the z direction. The overlapping portion of the overlapping wiring trace is not electrically bonded to the controller module.

A curtain airbag device mounting structure includes: a first pillar forming a part of a front pillar and extends substantially along a vehicle height direction; a second pillar forming another part of the front pillar, the second pillar being disposed on a rear side of a vehicle relative to the first pillar at a predetermined distance from the first pillar and extending substantially along the vehicle height direction; a transparent member bridged between the first pillar and the second pillar; and a curtain airbag device including a curtain airbag stored along a roof side rail and the second pillar, the curtain airbag being configured to inflate and deploy in a curtain-like fashion over a side portion of a cabin of the vehicle in case of a collision of the vehicle.

Embodiments of the present invention disclose a computer system having a plurality of quantum circuits arranged in a two-dimensional plane-like structure, the quantum circuits comprising qubits and busses (i.e., qubit-qubit interconnects), and a method of formation therefor. A quantum computer system comprises a plurality of quantum circuits arranged in a two-dimensional pattern. At least one interior quantum circuit, not along the perimeter of the two-dimensional plane of the plurality of quantum circuits, contains a bottom chip, a device layer, a top chip, and a routing layer. A signal wire connects the device layer to the routing layer, wherein the signal wire breaks the two dimensional plane, for example, the signal wire extends into a different plane.

A braze bonded nail head includes a nail head lead having a first end with first and second sides and a braze alloy preform coupled to the first side of the first end of the nail head lead The braze bonded nail head further includes a weld joint centrally located on the braze alloy preform and extending through the braze alloy preform to the first end of the nail head lead. The weld joint is formed through micro-tig-welding, in alternative embodiments of the invention, one of the nail head lead and the braze alloy preform may include at least one protrusion extending therefrom, while the other of the nail head lead and the braze alloy preforms may include at least one interfit element configured to interfit with the at least one protrusion.

Embodiments of the present invention disclose a computer system having a plurality of quantum circuits arranged in a two-dimensional plane-like structure, the quantum circuits comprising qubits and busses (i.e., qubit-qubit interconnects), and a method of formation therefor. A quantum computer system comprises a plurality of quantum circuits arranged in a two-dimensional pattern. At least one interior quantum circuit, not along the perimeter of the two-dimensional plane of the plurality of quantum circuits, contains a bottom chip, a device layer, a top chip, and a routing layer. A signal wire connects the device layer to the routing layer, wherein the signal wire breaks the two dimensional plane, for example, the signal wire extends into a different plane.

Embodiments of the present invention disclose a computer system having a plurality of quantum circuits arranged in a two-dimensional plane-like structure, the quantum circuits comprising qubits and busses (i.e., qubit-qubit interconnects), and a method of formation therefor. A quantum computer system comprises a plurality of quantum circuits arranged in a two-dimensional pattern. At least one interior quantum circuit, not along the perimeter of the two-dimensional plane of the plurality of quantum circuits, contains a bottom chip, a device layer, a top chip, and a routing layer. A signal wire connects the device layer to the routing layer, wherein the signal wire breaks the two dimensional plane, for example, the signal wire extends into a different plane.

Embodiments of the present invention disclose a computer system having a plurality of quantum circuits arranged in a two-dimensional plane-like structure, the quantum circuits comprising qubits and busses (i.e., qubit-qubit interconnects), and a method of formation therefor. A quantum computer system comprises a plurality of quantum circuits arranged in a two-dimensional pattern. At least one interior quantum circuit, not along the perimeter of the two-dimensional plane of the plurality of quantum circuits, contains a bottom chip, a device layer, a top chip, and a routing layer. A signal wire connects the device layer to the routing layer, wherein the signal wire breaks the two dimensional plane, for example, the signal wire extends into a different plane.

A semiconductor device includes a first device having a first pad; a second device having a second pad; and a bonding wire electrically connecting the first device and the second device to each other via the first pad and the second pad. The bonding wire includes: a first bonding structure provided at a first end of the bonding wire, electrically connected to the first device and includes: a first ball bonding region; and a first stitch bonding region; and a second bonding structure provided at a second end opposite of the first end of the bonding wire and electrically connected to the second device.

A curtain airbag device mounting structure includes: a first pillar forming a part of a front pillar and extends substantially along a vehicle height direction; a second pillar forming another part of the front pillar, the second pillar being disposed on a rear side of a vehicle relative to the first pillar at a predetermined distance from the first pillar and extending substantially along the vehicle height direction; a transparent member bridged between the first pillar and the second pillar; and a curtain airbag device including a curtain airbag stored along a roof side rail and the second pillar, the curtain airbag being configured to inflate and deploy in a curtain-like fashion over a side portion of a cabin of the vehicle in case of a collision of the vehicle.