A method for manufacturing a semiconductor device includes: a first bonding process including bonding, at a first bonding point, a tip of a wire held by a capillary; a first lifting process including moving the capillary upward; a first reverse process including moving the capillary in a direction that includes a component in a first direction that is from a second bonding point toward the first bonding point; a second lifting process including moving the capillary upward; a second reverse process including moving the capillary in the first direction; a third lifting process including moving the capillary upward; a forward process including moving the capillary toward the second bonding point; and a second bonding process including bonding the wire at the second bonding point. A movement distance of the capillary in the first lifting process is not less than a movement distance of the capillary in the second lifting process.

Embodiments disclosed herein include wire bonds and tools for forming wire bonds. In an embodiment, a wire bond may comprise a first attachment ball, and a first wire having a first portion contacting the first attachment ball and a second portion. In an embodiment, the wire bond may further comprise a second attachment ball, and a second wire having a first portion contacting the second attachment ball and a second portion. In an embodiment, the second portion of the first wire is connected to the second portion of the second wire.

Embodiments disclosed herein include wire bonds and tools for forming wire bonds. In an embodiment, a wire bond may comprise a first attachment ball, and a first wire having a first portion contacting the first attachment ball and a second portion. In an embodiment, the wire bond may further comprise a second attachment ball, and a second wire having a first portion contacting the second attachment ball and a second portion. In an embodiment, the second portion of the first wire is connected to the second portion of the second wire.

A method for manufacturing a semiconductor device includes: a first bonding process including bonding, at a first bonding point, a tip of a wire held by a capillary; a first lifting process including moving the capillary upward; a first reverse process including moving the capillary in a direction that includes a component in a first direction that is from a second bonding point toward the first bonding point; a second lifting process including moving the capillary upward; a second reverse process including moving the capillary in the first direction; a third lifting process including moving the capillary upward; a forward process including moving the capillary toward the second bonding point; and a second bonding process including bonding the wire at the second bonding point. A movement distance of the capillary in the first lifting process is not less than a movement distance of the capillary in the second lifting process.