Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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H01L2224/8585
using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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H01L2224/85855
Hardening the adhesive by curing, i.e. thermosetting
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H01L2224/85871
Visible light curing
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H01L2224/85871

Selective Soldering with Photonic Soldering Technology
20210185831 · 2021-06-17 ·

Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

Selective Soldering with Photonic Soldering Technology
20210043597 · 2021-02-11 ·

Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

Selective soldering with photonic soldering technology
12041728 · 2024-07-16 · ·

Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.