A display substrate, including: a base substrate including at least a side edge and a display area; a plurality of pixel units disposed in the display area, a second pixel unit is located on a side of a first pixel unit close to the side edge, edges of the second pixel unit include the side edge, a third pixel unit is located between the first pixel unit and the second pixel unit, and the third pixel unit is adjacent to the second pixel unit; and a plurality of light emitting diode chips disposed on the base substrate a first light emitting diode chip is located in the first pixel unit, a part of a second light emitting diode chip is located in the second pixel unit, and the other part of the second light emitting diode chip is located in the third pixel unit.

A semiconductor structure is disclosed. The semiconductor structure includes a substrate an elastomer coupled to the substrate and a plurality of bondfingers on the elastomer. The substrate, the elastomer and the bondfingers are configured to cooperatively expand and retract.

A semiconductor structure is disclosed. The semiconductor structure includes a substrate an elastomer coupled to the substrate and a plurality of bondfingers on the elastomer. The substrate, the elastomer and the bondfingers are configured to cooperatively expand and retract.

A die package having mixed impedance leads where a first lead has a first metal core, and a dielectric layer surrounding the first metal core, and a second lead has a second metal core, and a second dielectric layer surrounding the second metal core, with the dielectric thicknesses differing from each other. A method of making a die package having leads with different impedances formed by connecting the die package to the die substrate connection pads via a first wirebond having a first metal core, depositing a dielectric layer on the wirebond metal core, metalizing the dielectric layer, connecting the die package to the die substrate connection pads via a second wirebond having a second metal core, depositing a dielectric layer on the second wirebond second metal core, and metalizing the dielectric layer on the second metal core, such that the first wirebond has a different impedance than the second wire bond.

Wire bonding operations can be facilitated through the use of metal nanoparticle compositions. Both ball bonding and wedge bonding processes can be enhanced in this respect. Wire bonding methods can include providing a wire payout at a first location from a rolled wire source via a dispensation head, contacting a first metal nanoparticle composition and a first portion of the wire payout with a bonding pad, and at least partially fusing metal nanoparticles in the first metal nanoparticle composition together to form an adhering interface between the bonding pad and the first portion of the wire payout. The adhering interface can have a nanoparticulate morphology. Wire bonding systems can include a rolled wire source, a dispensation head configured to provide a wire payout, and an applicator configured to place a metal nanoparticle composition upon at least a portion of the wire payout or upon a bonding pad.

Wire bonding operations can be facilitated through the use of metal nanoparticle compositions. Both ball bonding and wedge bonding processes can be enhanced in this respect. Wire bonding methods can include providing a wire payout at a first location from a rolled wire source via a dispensation head, contacting a first metal nanoparticle composition and a first portion of the wire payout with a bonding pad, and at least partially fusing metal nanoparticles in the first metal nanoparticle composition together to form an adhering interface between the bonding pad and the first portion of the wire payout. The adhering interface can have a nanoparticulate morphology. Wire bonding systems can include a rolled wire source, a dispensation head configured to provide a wire payout, and an applicator configured to place a metal nanoparticle composition upon at least a portion of the wire payout or upon a bonding pad.

Wire bonding operations can be facilitated through the use of metal nanoparticle compositions. Both ball bonding and wedge bonding processes can be enhanced in this respect. Wire bonding methods can include providing a wire payout at a first location from a rolled wire source via a dispensation head, contacting a first metal nanoparticle composition and a first portion of the wire payout with a bonding pad, and at least partially fusing metal nanoparticles in the first metal nanoparticle composition together to form an adhering interface between the bonding pad and the first portion of the wire payout. The adhering interface can have a nanoparticulate morphology. Wire bonding systems can include a rolled wire source, a dispensation head configured to provide a wire payout, and an applicator configured to place a metal nanoparticle composition upon at least a portion of the wire payout or upon a bonding pad.

A die package having a plurality of connection pads, a die substrate supporting a plurality of connection elements, a first lead having a first metal core with a first core diameter, and a dielectric layer surrounding the first metal core, the dielectric layer having a first dielectric thickness that varies along its length and/or the dielectric layer having an outer metal layer at least partially surrounding the dielectric layer, for selectively modifying the electrical characteristics of the lead.

A display substrate, including: a base substrate including at least a side edge and a display area; a plurality of pixel units disposed in the display area, a second pixel unit is located on a side of a first pixel unit close to the side edge, edges of the second pixel unit include the side edge, a third pixel unit is located between the first pixel unit and the second pixel unit, and the third pixel unit is adjacent to the second pixel unit; and a plurality of light emitting diode chips disposed on the base substrate a first light emitting diode chip is located in the first pixel unit, a part of a second light emitting diode chip is located in the second pixel unit, and the other part of the second light emitting diode chip is located in the third pixel unit.

Wire bonding operations can be facilitated through the use of metal nanoparticle compositions. Both ball bonding and wedge bonding processes can be enhanced in this respect. Wire bonding methods can include providing a wire payout at a first location from a rolled wire source via a dispensation head, contacting a first metal nanoparticle composition and a first portion of the wire payout with a bonding pad, and at least partially fusing metal nanoparticles in the first metal nanoparticle composition together to form an adhering interface between the bonding pad and the first portion of the wire payout. The adhering interface can have a nanoparticulate morphology. Wire bonding systems can include a rolled wire source, a dispensation head configured to provide a wire payout, and an applicator configured to place a metal nanoparticle composition upon at least a portion of the wire payout or upon a bonding pad.