A semiconductor package includes a first redistribution substrate, a first semiconductor chip mounted on the first redistribution substrate, a second semiconductor chip disposed on a top surface of the first semiconductor chip, an insulating layer surrounding the first and second semiconductor chips on the first redistribution substrate, a second redistribution substrate disposed on the second semiconductor chip and on which the second semiconductor chip is mounted, and a connection terminal disposed at a side of the first and second semiconductor chips and connected to the first and second redistribution substrates. An inactive surface of the second semiconductor chip is in contact with an inactive surface of the first semiconductor chip. At an interface of the first and second semiconductor chips, an upper portion of the first semiconductor chip and a lower portion of the second semiconductor chip constitute one body formed of a same material.

A semiconductor package includes a first redistribution substrate, a first semiconductor chip mounted on the first redistribution substrate, a second semiconductor chip disposed on a top surface of the first semiconductor chip, an insulating layer surrounding the first and second semiconductor chips on the first redistribution substrate, a second redistribution substrate disposed on the second semiconductor chip and on which the second semiconductor chip is mounted, and a connection terminal disposed at a side of the first and second semiconductor chips and connected to the first and second redistribution substrates. An inactive surface of the second semiconductor chip is in contact with an inactive surface of the first semiconductor chip. At an interface of the first and second semiconductor chips, an upper portion of the first semiconductor chip and a lower portion of the second semiconductor chip constitute one body formed of a same material.

Shielding for flip chip devices. In some embodiments, a shielded assembly can include a substrate and a flip chip die having a front side and a back side, with the including an integrated circuit implemented on the front side, and the front side of the flip chip die being mounted to the substrate. The shielded assembly can further include a shielding component implemented over the back side of the flip chip die to provide electromagnetic shielding between a first region within or on the flip chip die and a second region away from the flip chip die.

Shielding for flip chip devices. In some embodiments, a shielded assembly can include a substrate and a flip chip die having a front side and a back side, with the including an integrated circuit implemented on the front side, and the front side of the flip chip die being mounted to the substrate. The shielded assembly can further include a shielding component implemented over the back side of the flip chip die to provide electromagnetic shielding between a first region within or on the flip chip die and a second region away from the flip chip die.

In some embodiments, a radio-frequency device can be manufactured by a method that includes forming or providing a substrate, fabricating or providing a flip chip die having a front side and a back side, and including an integrated circuit implemented on the front side, and mounting the front side of the flip chip die on the substrate. The method can further include implementing a shielding component over the back side of the flip chip die to provide electromagnetic shielding between a first region within or on the flip chip die and a second region away from the flip chip die.

In some embodiments, a radio-frequency device can be manufactured by a method that includes forming or providing a substrate, fabricating or providing a flip chip die having a front side and a back side, and including an integrated circuit implemented on the front side, and mounting the front side of the flip chip die on the substrate. The method can further include implementing a shielding component over the back side of the flip chip die to provide electromagnetic shielding between a first region within or on the flip chip die and a second region away from the flip chip die.

A semiconductor package includes a build-up structure; a semiconductor disposed on the build-up structure in a flip-chip manner and having a plurality of bumps penetrating therethrough; an electronic element disposed on the semiconductor chip; and an encapsulant formed on the build-up structure and encapsulating the semiconductor chip and the electronic element, thereby improving the product yield and the overall heat dissipating efficiency.

A semiconductor package includes a build-up structure; a semiconductor disposed on the build-up structure in a flip-chip manner and having a plurality of bumps penetrating therethrough; an electronic element disposed on the semiconductor chip; and an encapsulant formed on the build-up structure and encapsulating the semiconductor chip and the electronic element, thereby improving the product yield and the overall heat dissipating efficiency.

Shielding for flip chip devices. In some embodiments, a shielded assembly can include a substrate and a flip chip die having a front side and a back side, with the including an integrated circuit implemented on the front side, and the front side of the flip chip die being mounted to the substrate. The shielded assembly can further include a shielding component implemented over the back side of the flip chip die to provide electromagnetic shielding between a first region within or on the flip chip die and a second region away from the flip chip die.

Shielding for flip chip devices. In some embodiments, a shielded assembly can include a substrate and a flip chip die having a front side and a back side, with the including an integrated circuit implemented on the front side, and the front side of the flip chip die being mounted to the substrate. The shielded assembly can further include a shielding component implemented over the back side of the flip chip die to provide electromagnetic shielding between a first region within or on the flip chip die and a second region away from the flip chip die.