An image pickup apparatus includes: an image pickup device including a light receiving surface, an opposite surface, and an inclined surface inclined at a first angle, and provided with light receiving surface electrodes on the light receiving surface; a cover glass; and a wiring board including a first main surface and a second main surface, and including wires each connected with each of the light receiving surface electrodes, back surfaces of the light receiving surface electrodes are exposed to a side of the opposite surface, distal end portions of the wires are flying leads bent at a second angle in a relation of a supplementary angle to the first angle and connected with the light receiving surface electrodes, and the second main surface at a distal end portion of the wiring board is directly fixed to the opposite surface arranged in parallel with the second main surface.

Flexible interconnects, flexible integrated circuit systems and devices, and methods of making and using flexible integrated circuitry are presented herein. A flexible integrated circuit system is disclosed which includes first and second discrete devices that are electrically connected by a discrete flexible interconnect. The first discrete devices includes a first flexible multi-layer integrated circuit (IC) package with a first electrical connection pad on an outer surface thereof. The second discrete device includes a second flexible multi-layer integrated circuit (IC) package with a second electrical connection pad on an outer surface thereof. The discrete flexible interconnect is attached to and electrically connects the first electrical connection pad of the first discrete device to the second electrical connection pad of the second discrete device.

A semiconductor arrangement is provided. The semiconductor arrangement may include an electrically conductive plate having a surface, a plurality of power semiconductor devices arranged on the surface of the electrically conductive plate, wherein a first controlled terminal of each power semiconductor device of the plurality of power semiconductor devices may be electrically coupled to the electrically conductive plate, a plurality of electrically conductive blocks, wherein each electrically conductive block may be electrically coupled with a respective second controlled terminal of each power semiconductor device of the plurality of power semiconductor devices; and encapsulation material encapsulating the plurality of power semiconductor devices, wherein at least one edge region of the surface of the electrically conductive plate may be free from the encapsulation material.

An integrated circuit includes a lead frame having a die attach paddle with a slot extending through the die attach paddle from a first surface to a second surface. A plurality of semiconductor die are positioned such that a channel is formed between the first, second, and third semiconductor die and the slot of the die attach paddle. A mold material encloses the plurality of semiconductor die and at least a portion of the lead frame and is disposed in the channel such that the second surface of the die attach paddle is substantially flush with the mold material. A method of forming an integrated circuit is also provided.

An image pickup apparatus includes: an image pickup device including a light receiving surface, an opposite surface, and an inclined surface inclined at a first angle, and provided with light receiving surface electrodes on the light receiving surface; a cover glass; and a wiring board including a first main surface and a second main surface, and including wires each connected with each of the light receiving surface electrodes, back surfaces of the light receiving surface electrodes are exposed to a side of the opposite surface, distal end portions of the wires are flying leads bent at a second angle in a relation of a supplementary angle to the first angle and connected with the light receiving surface electrodes, and the second main surface at a distal end portion of the wiring board is directly fixed to the opposite surface arranged in parallel with the second main surface.

Flexible interconnects, flexible integrated circuit systems and devices, and methods of making and using flexible integrated circuitry are presented herein. A flexible integrated circuit system is disclosed which includes first and second discrete devices that are electrically connected by a discrete flexible interconnect. The first discrete devices includes a first flexible multi-layer integrated circuit (IC) package with a first electrical connection pad on an outer surface thereof. The second discrete device includes a second flexible multi-layer integrated circuit (IC) package with a second electrical connection pad on an outer surface thereof. The discrete flexible interconnect is attached to and electrically connects the first electrical connection pad of the first discrete device to the second electrical connection pad of the second discrete device.