An electronic module has a first electronic element 13, a first connector 60 provided in one side of the first electronic element 13, and having a first columnar part 62 extending to another side and a first groove part 64 provided in a one-side surface, and a second electronic element 23 provided in one side of the first connector 60 via a conductive adhesive agent provided inside a circumference of the first groove part 64. The first connector 60 has a first concave part 67 on one side at a position corresponding to the first columnar part 62.

The disclosure provides a chip component including a body and a bracket; the bracket includes a first welding part, a second welding part, and a connection part connecting to the first welding part and the second welding part; the first welding part is configured to be welded to a printed circuit board (PCB); the body includes a first electrode and a second electrode; the first electrode is welded to the second welding part, and the second electrode is configured to weld to the PCB. One of the purposes of the disclosure is to provide a chip component that can meet the needs of automatic production, so as to improve the production efficiency and reduce the cost.

An electronic module has a first substrate 11, an electronic element 13, 23 disposed on one side of the first substrate 11, a second substrate 21 disposed on one side of the electronic element 13, 23, a first coupling body 210 disposed between the first substrate 11 and the second substrate 21, a second coupling body 220 disposed between the first substrate 11 and the second substrate 21, and shorter than the first coupling body 210, and a sealing part 90 which seals at least the electronic element. The first coupling body 210 is not electrically connected to the electronic element. The second coupling body 220 is electrically connected to the electronic element 13, 23.