A display device includes a pixel array substrate and a circuit board. The pixel array substrate has a first surface, a second surface opposite to the first surface, and a first side surface connecting the first surface and the second surface. Multiple bonding pads are located on the first surface. The circuit board is bent from above the first surface of the pixel array substrate to below the second surface. The circuit board is electrically connected to the bonding pads and includes a thermoplastic substrate. The thermoplastic substrate includes a third surface facing the pixel array substrate and a fourth surface opposite to the third surface. The thermoplastic substrate includes a first bend formed by thermoplastics.

A chip on film package is disclosed, including a flexible film and a chip. The flexible film includes a film base, a patterned metal layer includes a plurality of pads and disposed on an upper surface of the film base, and a dummy metal layer covering a lower surface of the film base and capable of dissipating heat of the chip. The dummy metal layer comprises at least one opening exposing the second surface, and at least one of the plurality of pads is located within the at least one opening in a bottom view of the chip on film package. The chip is mounted on the plurality of pads of the patterned metal layer.

A stretchable display module includes a conductive substrate and a plurality of pixel units. The conductive substrate includes a substrate and a circuit layer formed on the substrate. The substrate has a plurality of predetermined areas, and the circuit layer defines a conductive contact group and at least one elastic wire structure connected to the conductive contact group in each of the predetermined areas. The at least one elastic wire structure has at least one patterned wire segment, and a stretch rate thereof along a length direction of the substrate is from 0% to 60%. The pixel units are respectively located in the predetermined areas, and each of the pixel units is bonded to the conductive contact group in the corresponding one of the predetermined areas.

A package carrier including a flexible substrate, a first build-up structure and a second build-up structure is provided. The flexible substrate has a first surface and a second surface opposite to each other, and has a first opening connected between the first surface and the second surface. The first build-up structure is disposed on the first surface and covers the first opening. The second build-up structure is disposed on the second surface and has a second opening, and the first opening and the second opening are connected to each other to form a chip accommodating cavity together. In addition, a manufacturing method of the package carrier and a chip package structure having the package carrier are also provided.

A fabric-based item may include fabric layers and other layers of material. An array of electrical components may be mounted in the fabric-based item. The electrical components may be mounted to a support structure such as a flexible printed circuit. The flexible printed circuit may have a mesh shape formed from an array of openings. Serpentine flexible printed circuit segments may extend between the openings. The electrical components may be light-emitting diodes or other electrical devices. Polymer with light-scattering particles or other materials may cover the electrical components. The flexible printed circuit may be laminated between fabric layers or other layers of material in the fabric-based item.

A semiconductor device includes a rigid flex circuit that has a first rigid region and a second rigid region that are electrically connected by a flexible portion. A first die is mounted to a first side of the first rigid region. A second die is mounted to a second side of the second rigid region. The first and second sides are on opposite sides of the rigid flex circuit. The flexible portion is bent to hold the first and second rigid regions in generally vertical alignment with each other.

A fingerprint recognition module according to an embodiment includes a substrate; a conductive pattern portion disposed on the substrate; a protective layer partially disposed on the substrate and the conductive pattern portion; a first connection portion disposed on a conductive pattern portion exposed through a first open region of the protective layer; and a first chip disposed on the first connection portion; wherein the first connection portion includes an anisotropic conductive adhesive disposed on the conductive pattern portion exposed through the first open region and having a closed loop shape and including conductive particles.

The invention relates to a multi-layer 3D foil package and to a method for manufacturing such a multi-layer 3D foil package. The 3D foil package has a foil substrate stack having at least two foil planes, wherein a first electrically insulating foil substrate is arranged in a first foil plane, and wherein a second electrically insulating foil substrate is arranged in a second foil plane, wherein the first foil substrate has a first main surface region on which at least one functional electronic component is arranged, wherein the second foil substrate has a cavity having at least one opening in the second main surface region, wherein the foil substrates within the foil substrate stack are arranged one above the other such that the functional electronic component arranged on the first foil substrate is arranged within the cavity provided in the second foil substrate.

The present invention relates to a method of connecting circuit elements and a corresponding system for connecting circuit elements. The method includes providing a plurality of flexible circuit elements on a carrier element; forming a connecting structure. The formed connecting structure includes at least two contact points; and operative connections between each of the plurality of flexible circuit elements and the at least two contact points. The method further includes severing the operative connection between at least one of the plurality of flexible circuit elements and the at least two contact points.

Flexible modules and methods of manufacture are described. In an embodiment, a flexible module includes a flex board formed in which a passivation layer is applied in liquid form in a panel level process, followed by exposure and development. An electronic component is then mounted onto the flex board and encapsulated in a molding compound that is directly on a top surface of the passivation layer.