A memory card includes a plurality of interconnection terminals aligned in a row direction and a column direction on a substrate. Each of the plurality of interconnection terminals has a first-axis length equal to no more than 1.2 times that of a second-axis length thereof. A non-volatile memory device is disposed on the substrate. The non-volatile memory device is electrically connected to at least one interconnection terminal corresponding thereto from among the plurality of interconnection terminals.

A memory card includes a plurality of interconnection terminals aligned in a row direction and a column direction on a substrate. Each of the plurality of interconnection terminals has a first-axis length equal to no more than 1.2 time that of a second-axis length thereof. A non-volatile memory device is disposed on the substrate. The non-volatile memory device is electrically connected to at least one interconnection terminal corresponding thereto from among the plurality of interconnection terminals.

A memory card includes a plum its, of interconnection terminals aligned in a row direction and a column direction on a substrate. Each of the plurality of interconnection terminals has a first-axis length equal to no more than 1.2 time that of a second-axis length thereof. A non-volatile memory device is disposed on the substrate. The non-volatile memory device is electrically connected to at least one interconnection terminal corresponding thereto from among the plurality of interconnection terminals.

A semiconductor device includes a semiconductor chip, a bump contract, and encapsulating layer, an insulating layer, and a connection terminal.

There is provided a fingerprint sensor module comprising a fingerprint sensor device comprising a sensing array and at least one connection pad for electrically connecting the fingerprint sensor device to external circuitry, the sensing array and connection pad being located on a first side of the fingerprint sensing device; at least one electrically conductive via connection arranged adjacent to the fingerprint sensor device and in electrical contact with the connection pad via at least one conductive trace located in the same plane as the connection pad; a mold layer arranged to cover a backside of the fingerprint sensor device and to fill a volume between the fingerprint sensor device and the via connection, wherein an end portion of the via connection is exposed for connecting the fingerprint sensor module to external circuitry. There is also provided a method for manufacturing such a fingerprint sensor module.

There is provided a fingerprint sensor module comprising a fingerprint sensor device comprising a sensing array and at least one connection pad for electrically connecting the fingerprint sensor device to external circuitry, the sensing array and connection pad being located on a first side of the fingerprint sensing device; at least one electrically conductive via connection arranged adjacent to the fingerprint sensor device and in electrical contact with the connection pad via at least one conductive trace located in the same plane as the connection pad; a mold layer arranged to cover a backside of the fingerprint sensor device and to fill a volume between the fingerprint sensor device and the via connection, wherein an end portion of the via connection is exposed for connecting the fingerprint sensor module to external circuitry. There is also provided a method for manufacturing such a fingerprint sensor module.

A semiconductor device includes a semiconductor chip, a bump contract, and encapsulating layer, an insulating layer, and a connection terminal.

A fingerprint sensor package includes: a first substrate including a core insulating layer including a first surface and a second surface and a through-hole, a first bonding pad on the second surface, and an external connection pad between an edge of the second surface and the first bonding pad; a second substrate in the through-hole and including a third surface and a fourth surface, and including first sensing patterns on the third surface, spaced apart in a first direction, and extending in a second direction, second sensing patterns spaced apart from each other in the second direction and extending in the first direction, and a second bonding pad on the fourth surface; a conductive support electrically connecting the first bonding pad and the second bonding pad and supporting the first substrate and the second substrate; a controller chip on the second substrate; and a molding layer on the second surface.

An integrated circuit chip stack includes a main integrated circuit chip and at least one auxiliary integrated circuit chip. The main integrated circuit chip contains circuit components to be protected. The auxiliary integrated circuit chip is mounted to a surface of the main integrated circuit chip and includes a metal plane connected to ground located opposite the circuit components to be protected. The auxiliary integrated circuit chip further includes at least one insulated conductive track forming a tight pattern opposite the circuit components to be protected. A detection circuit is connected to the at least one conductive track and is configured to detect interruption of the at least one insulated conductive track.

The described Flexible Micro-Module (FMM) is a device that is made possible by the application of ultra-thin flexible single crystalline ICs. The FMM integrates the IC(s), insulating contact substrate, vias for connections to pads, and external contacts into a single device. The thin and flexible FMM eliminates the need for wire bonds and card body cavities in smart card assemblies, and accommodates applying larger ICs to smart cards than what is possible with conventional micro-modules.