A bonding apparatus includes: an anisotropic conductive film (“ACF”) attachment unit which attaches a first ACF and a second ACF onto a display panel assembly; a compression unit which compresses a first chip-on-film (“COF”) on the first ACF and compresses a second COF on the second ACF; and a buffer unit which rotates the display panel assembly, on which the first ACF and the second COF are compressed, on a plane.

A bonding and indexing method is provided, having a first index head to move a substrate in an indexing direction from a first position to a second position; a second index head to move the substrate in an indexing direction from the second position to a third position; and the first and/or second index head has a bonding element to effect a bonding process between the substrate and an element disposed against the substrate so that bonding and movement in the indexing direction is implemented simultaneously by the first index head and/or bonding and movement in the indexing direction is implemented simultaneously by the second index head.

A bonding and indexing apparatus has a first index head to move a substrate in an indexing direction from a first position to a second position and a second index head to move the substrate in an indexing direction from the second position to a third position. The first and/or second index head has a bonding element to effect a bonding process between the substrate and an element disposed against the substrate so that bonding and movement in the indexing direction is implemented simultaneously by the first index head and/or bonding and movement in the indexing direction is implemented simultaneously by the second index head.

A method of directly transferring a first semiconductor device die to a substrate includes loading a wafer tape into a first frame, loading a substrate into a second frame, arranging at least one of the first frame or the second frame such that a surface of the substrate is adjacent to a first side of the wafer tape, and orienting a needle to a position adjacent to a second side of the wafer tape, the needle extending in a direction toward the wafer tape. The method also includes activating a needle actuator connected to the needle to move the needle to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die.

The present disclosure provides a chip packaging device, a chip packaging method, and a package chip, and is related to a technical field of chip packaging. The chip packaging device includes conductive sheets, a vacuum suction movable assembly defining a variable suction surface, and a heating assembly. The variable suction surface sucks the plurality of conductive sheets. A first end of each of the conductive sheets is disposed above a corresponding bonding pads. A second end of each of the conductive sheets is disposed above a corresponding welding pin, so that when the variable suction surface is pressed down, the first end of each of the conductive sheets is pressed onto the corresponding bonding pad, and the second end of each of the conductive sheets is pressed onto the corresponding welding pin. The heating assembly heats solders on the bonding pads and the welding pins.

A mask-integrated surface protective tape with a release liner, containing: a base film, a temporary-adhesive layer, a release film, a mask material layer, and a release liner, in this order, wherein the release film and the release liner each have one release-treated surface, and the release-treated surfaces of the release film and the release liner each are in contact with the mask material layer, and wherein the peeling strength between the release liner and the mask material layer is smaller than the peeling strength between the release film and the mask material layer.

Disclosed is a connection jig tape for splicing end portions of feeding tapes together, the feeding tape comprising accommodating spaces formed to accommodate electronic parts therein, a protection tape disposed on the electronic parts, and a plurality of transfer holes formed at one side thereof, the connection jig comprising: a base tape comprising projections formed to protrude from opposite sides thereof or at least two projections formed to protrude from one side thereof and spaced apart from each other to be inserted in the transfer holes of the respective feeding tapes to be spliced together; and a first splicing tape disposed on the base tape.

Bonding device for producing bonding connections, in particular wire bonding connections, tape bonding connections and ball bonding connections, on carriers fixed outside the bonding device and having contact surfaces for the bonding connections, in different spatial directions with respect to the respective carrier, the bonding device comprising a base body, a bonding tool which is movable relative to the base body for applying a bonding force to a bonding means placed on the contact surface of the carrier to produce a material bond between the bonding means and the contact surface as a bonding connection, and bonding force generating means for generating a bonding force directed towards the contact surface when the bonding tool is placed on the carrier, wherein the bonding force generating means comprise a bonding force setting device for realizing a predetermined effective bonding force independently of its spatial direction of action.

This thermocompression bonding device is provided with a heating tool (1) and a backup member (3). The backup member (3) has: a support portion (3a) which faces the tip (1a) of the heating tool (1) while first and second members (111, 122) to be joined and a cushioning member (2) are located therebetween, and which supports the first and second members (111, 122) to be joined; and a body portion (3b) provided on the opposite side of the support portion (3a) from the first and second members (111, 122) to be joined. The support portion (3a) is formed so that the heat conductivity thereof is lower than that of the body portion (3b).

A power electronics method and assembly produced by the method. The assembly has a substrate, having a power semiconductor element, and an adhesion layer disposed therebetween, wherein the substrate has a first surface that faces a power semiconductor element, a power semiconductor element has a third surface that faces the substrate, the adhesion layer has a second surface which, preferably across the full area, contacts the third surface and has a first consistent surface contour having a first roughness, and wherein a fourth surface of the power semiconductor element that is opposite the third surface has a second surface contour having a second roughness, said second surface contour following the first surface contour.