H01L25/073

Modular distributed control led display system
11495584 · 2022-11-08 · ·

A modular distributed control LED display system, comprising several LED display module units (100) which are spliced together to form an integrated LED display screen, each of the LED display module units (100) comprises a lamp board (110) and an independent controller (120), wherein the lamp board (110) is provided with a number of LED light sources, and the independent controller (120) is provided on the back of the lamp board (110), the independent controller (120) is used to control the working state and display mode of the LED light sources.

Modularized spliced LED display screen
11244933 · 2022-02-08 · ·

The present invention relates to a modularized spliced LED display screen including a plurality of unit screens. When assembling, a certain number of the unit screens are assembled in a splicing frame to form a module screen. A number of the said module screens are assembled horizontally to form a large display screen. The present invention forms a module screen by a plurality of unit screens of the same structure, and then assembles a plurality of module screens horizontally to form a large display screen, and the overall assembly method is simple, and is easy to assemble and disassemble.

Heat dissipation substrate for multi-chip package

A chip packaging structure includes a heat dissipation substrate, a pre-molded chipset, an interconnection and a second encapsulant. The pre-molded chipset is located on the heat dissipation substrate. The interconnection is located in the packaging structure and electrically connects the heat dissipation substrate and the pre-molded chipset. The second encapsulant covers part of the heat dissipation substrate, part or all of the interconnection, and part or all of the pre-molded chipset. The pre-molded chipset includes a thermally conductive substrate, at least two chips, a patterned circuit, and a first encapsulant. The patterned circuit is located in the pre-molded chipset. At least two chips are electrically connected by the patterned circuit. The first encapsulant covers at least two chips and part or all of the patterned circuit. A manufacturing method of a chip packaging structure is also provided.

Integrated control LED display system
11508702 · 2022-11-22 · ·

An integrated control LED display system, comprising a number of module screens (100) which are assembled together to form a large display screen, each of the module screens (100) comprises several unit screens (200), a splicing frame (300) and a control box (400), several unit screens (200) are assembled in the splicing frame (300) to form a said module screen (100), the control box (400) is arranged on the back of the module screen (100), and the control box (400) can simultaneously control the work mode of the unit screens (200).

Power conversion apparatus
11056417 · 2021-07-06 · ·

A power conversion apparatus includes a plurality of semiconductor modules each having a semiconductor element integrated thereto; a plurality of cooling pipes that cools the semiconductor modules; a plurality of dummy modules with no integrated semiconductor element; and a pair of DC bus bars that constitute a current path between a DC power source and respective semiconductor modules. The semiconductor modules or the dummy modules, and the cooling pipes are alternately stacked to form a stack; m the plurality of semiconductor modules constitute an inverter circuit that converts a DC power supplied from the DC power source into a multi-phase AC power in which a plurality of types of AC outputs having mutually different phases are combined; and the dummy modules are each interposed between two semiconductor modules having mutually different phases of the AC outputs.

Modular Distributed Control LED Display System
20210005585 · 2021-01-07 · ·

A modular distributed control LED display system, comprising several LED display module units (100) which are spliced together to form an integrated LED display screen, each of the LED display module units (100) comprises a lamp board (110) and an independent controller (120), wherein the lamp board (110) is provided with a number of LED light sources, and the independent controller (120) is provided on the back of the lamp board (110), the independent controller (120) is used to control the working state and display mode of the LED light sources.

Modularized Spliced LED Display Screen
20210005783 · 2021-01-07 · ·

The present invention relates to a modularized spliced LED display screen including a plurality of unit screens. When assembling, a certain number of the unit screens are assembled in a splicing frame to form a module screen. A number of the said module screens are assembled horizontally to form a large display screen. The present invention forms a module screen by a plurality of unit screens of the same structure, and then assembles a plurality of module screens horizontally to form a large display screen, and the overall assembly method is simple, and is easy to assemble and disassemble.

Integrated Control LED Display System
20210005798 · 2021-01-07 ·

An integrated control LED display system, comprising a number of module screens (100) which are assembled together to form a large display screen, each of the module screens (100) comprises several unit screens (200), a splicing frame (300) and a control box (400), several unit screens (200) are assembled in the splicing frame (300) to form a said module screen (100), the control box (400) is arranged on the back of the module screen (100), and the control box (400) can simultaneously control the work mode of the unit screens (200).

Power Semiconductor Arrangement and Method for Fabricating a Power Semiconductor Arrangement

A power semiconductor arrangement includes first and second power semiconductor modules. Each power semiconductor module has a first main side and an opposing second main side. The power semiconductor modules are arranged such that a main side of the first power semiconductor module and a main side of the second power semiconductor module are facing each other. The power semiconductor arrangement further includes a cooler housing configured for direct liquid cooling of the power semiconductor modules. The cooler housing includes a fluid channel. At least one main side of the first power semiconductor module forms a sidewall of the fluid channel. A flow direction in the fluid channel along the first main side and a flow direction along the second main side of the first power semiconductor module are oriented in opposite directions.

Projection display system

A light-emitting diode (LED) projector includes an LED display panel and a projection lens arranged in front of LED display panel and configured to collect and project light emitted by the LED display panel. The LED display panel includes an LED panel and a micro lens array arranged over the LED panel. The LED panel includes a substrate, a driver circuit array on the substrate and including a plurality of pixel driver circuits arranged in an array, and an LED array including a plurality of LED dies each being coupled to one of the pixel driver circuits. The micro lens array includes a plurality of micro lenses each corresponding to and being arranged over at least one of the LED dies.