In a particular implementation, an apparatus to control clamping devices includes a detection circuitry, a clamping device, inverter circuitry, and first and second control circuitry. In response to a first voltage corresponding to a gate terminal of the clamping device, the first control circuitry is configured to generate a second voltage to set the first voltage below a first voltage threshold. Also, in response to the second voltage, the second control circuitry is configured to generate a third voltage to set a voltage of the detection circuitry below a second voltage threshold.

An electronic circuit includes a switch coupled between an input terminal intended to receive a first voltage and an output terminal coupled to a decoupling capacitor and intended to also be coupled to a load. A comparison stage is configured to compare the first voltage and a second voltage that is present at the output terminal. A first adjustment stage is configured to limit a positive inrush current flowing between the input terminal and the output terminal and a second adjustment stage is configured to limit a negative inrush current flowing between the output terminal and the input terminal. A control circuit is configured to activate either the first adjustment stage or the second adjustment stage as a function of a result of the comparison.

An electrostatic discharge protection circuit capable of clamping both positive and negative ESD events and passing signals is provided. Generally, the circuit includes a p-channel field-effect transistor (PFET) clamp coupled to a pin to be protected, the PFET clamp including a plurality of PFETs in a DN-well, an n-channel field-effect transistors (NFET) clamp coupled between ground and the pin through the PFET clamp, the NFET clamp including a plurality of NFETs coupled in series, and a bias network for biasing a voltage of the DN well to substantially equal a voltage on the pin when the voltage on the pin is greater than ground potential, and to ground potential when the pin voltage is less than ground potential. The plurality of are PFETs coupled in parallel between the pin and the NFET clamp, each of the PFETs is coupled to the pin though one of a plurality ballast resistors.

An ESD protection circuit includes a power MOS transistor disposed between a first line and a second line, a clamp circuit disposed between the first line and a first node to which a gate of the power MOS transistor is coupled, a first resistor disposed between the first node and the second line, a MOS transistor disposed between the first node and the second line, a third line supplied with a third potential generated by a constant-voltage circuit of the protection target circuit, and a second resistor and a first capacitor coupled in series between a second node coupled to the third line and the second line, wherein when defining a junction between the second resistor and the first capacitor as a third node, a gate of the MOS transistor is coupled to the third node.

A semiconductor device is provided. The semiconductor device comprises a detection circuit electrically coupled between a first node and a second node. The semiconductor device comprises a discharge circuit electrically coupled between the first node and a third node. The semiconductor device comprises a biasing circuit electrically coupled between the second node and the third node. The discharge circuit and the biasing circuit are configured to electrically conduct the first node and the second node in response to receiving a first signal from the detection circuit through a fourth node. A first voltage difference exists between the third node and the fourth node.

A memory device includes a well, a first gate layer, a second gate layer, a doped region, a blocking layer and an alignment layer. The first gate layer is formed on the well. The second gate layer is formed on the well. The doped region is formed within the well and located between the first gate layer and the second gate layer. The blocking layer is formed to cover the first gate layer, the first doped region and a part of the second gate layer and used to block electrons from excessively escaping. The alignment layer is formed on the blocking layer and above the first gate layer, the doped region and the part of the second gate layer. The alignment layer is thinner than the blocking layer, and the alignment layer is thinner than the first gate layer and the second gate layer.

A voltage tracking circuit includes first, second, third and fourth transistors. The first transistor is in a first well, and includes a first gate, a first drain and a first source coupled to a first voltage supply. The second transistor includes a second gate, a second drain and a second source. The second source is coupled to the first drain. The second gate is coupled to the first gate and the pad voltage terminal. The third transistor includes a third gate, a third drain and a third source. The fourth transistor includes a fourth gate, a fourth drain and a fourth source. The fourth drain is coupled to the third source. The fourth source is coupled to the pad voltage terminal. The fourth transistor is in a second well different from the first well, and is separated from the first well in a first direction.

A system includes a clamp network coupled between an input and an output and configured to clamp a voltage between the input and the output to a first clamp voltage based on the presence of a trigger signal and to a second clamp voltage based on the absence of the trigger signal. The second clamp voltage is greater than the first clamp voltage and the first clamp voltage is less than a breakdown voltage of the power transistor device. A detector circuit is coupled to the input and the output. A power transistor device may also be coupled between the input and the output. The detector circuit is configured to detect a pulse signal at the input or the output while the power transistor device is off and to generate the trigger signal for a time interval based on detecting the pulse signal.

An electrostatic discharge (ESD) protection circuit includes a first transistor, a second transistor, a capacitor, a voltage dividing circuit, and a first diode. The first transistor is coupled between a first power rail and a second power rail. The second transistor is coupled between the first power rail and the second power rail. A bulk of the second transistor is coupled to a control terminal of the first transistor. The capacitor is coupled between the first power rail and a control terminal of the second transistor. The voltage dividing circuit is coupled between the control terminal of the second transistor and the second power rail, and has a divided voltage output terminal coupled to the bulk of the second transistor. The first diode is coupled between the divided voltage output terminal and the second power rail.

An IC layout of a pre-driving circuit, comprising: a plurality of type one transistor regions, having a density smaller than a predetermined level; and a type two bulk region, surrounding the type one transistor regions.