Methods of manufacturing device assemblies, as well as associated semiconductor assemblies, devices, systems are disclosed herein. In one embodiment, a method of forming a semiconductor device assembly includes forming a semiconductor device assembly that includes a handle substrate, a semiconductor structure having a first side and a second side opposite the first side, and an intermediary material between the semiconductor structure and the handle substrate. The method also includes removing material from the semiconductor structure to form an opening extending from the first side of the semiconductor structure to at least the intermediary material at the second side of the semiconductor structure. The method further includes removing at least a portion of the intermediary material through the opening in the semiconductor structure to undercut the second side of the semiconductor structure.

A high electron mobility transistor (HEMT) made of primarily nitride semiconductor materials is disclosed. The HEMT, which is a type of reverse HEMT, includes, on a C-polar surface of a SiC substrate, a barrier layer and a channel layer each having N-polar surfaces in respective top surfaces thereof. The HEMT further includes an intermediate layer highly doped with impurities and a Schottky barrier layer on the channel layer. The Schottky barrier layer and a portion of the intermediate layer are removed in portions beneath non-rectifying electrodes but a gate electrode is provided on the Schottky barrier layer.

A semiconductor device includes a transistor. The transistor includes a gate electrode, a channel layer, a gate dielectric layer, a first source/drain region and a second source/drain region and a dielectric pattern. The channel layer is disposed on the gate electrode. The gate dielectric layer is located between the channel layer and the gate electrode. The first source/drain region and the second source/drain region are disposed on the channel layer at opposite sides of the gate electrode. The dielectric pattern is disposed on the channel layer. The first source/drain region covers a first sidewall and a first surface of the dielectric pattern, and a second sidewall opposite to the first sidewall of the dielectric pattern is protruded from a sidewall of the first source/drain region.

A high electron mobility transistor includes a stack of layers including a passivation layer and a heterojunction including a first semiconductor layer, a second semiconductor layer and a two-dimensional electron gas at the interface thereof, one surface of the passivation layer being in contact with the first semiconductor layer; a source metal contact and/or a drain metal contact and a gate electrode; an n+ doped zone situated inside the heterojunction; the source metal contact and/or the drain metal contact being positioned at the level of a recess formed in the stack of layers, the source metal contact and/or said drain metal contact having a thickness defined by an upper face and a lower face substantially parallel to the plane of the layers, the upper face being planar, the lower face being in contact with the n+ doped zone and below the interface between the first and second semiconductor layers.

A semiconductor device including an active pattern on a substrate and extending lengthwise in a first direction parallel to an upper surface of the substrate; a gate structure on the active pattern, the gate structure extending in a second direction parallel to the upper surface of the substrate and crossing the first direction; channels spaced apart from each other along a third direction perpendicular to the upper surface of the substrate, each of the channels extending through the gate structure along the first direction; a source/drain layer on a portion of the active pattern adjacent to the gate structure in the first direction, the source/drain layer contacting the channels; inner spacers between the gate structure and the source/drain layer, the inner spacers contacting the source/drain layer; and channel connection portions between each of the inner spacers and the gate structure, the channel connection portions connecting the channels with each other.

A nitride semiconductor device having a field effect gate is disclosed. The disclosed nitride semiconductor device includes a high-resistance material layer including a Group III-V compound semiconductor, a first channel control layer on the high-resistance material layer and including a Group III-V compound semiconductor of a first conductivity type, a channel layer on the channel layer control layer and including a nitride semiconductor of a second conductivity type opposite to the first conductivity type, and a gate electrode having a contact of an ohmic contact type with the first channel control layer.

The present disclosure relates to semiconductor power devices, and in particular, to a high-electron-mobility transistor (HEMT) with high voltage endurance capability and a preparation method thereof. The high-electron-mobility transistor with high voltage endurance capability includes a gate electrode, a source electrode, a drain electrode, a barrier layer, a P-type nitride semiconductor layer and a substrate, wherein the P-type nitride semiconductor layer is between the barrier layer and the substrate, which is insufficient to significantly deplete a two-dimensional electron gas in a channel except a gate stack, the source electrode is in electrical contact with the P-type nitride semiconductor layer, and the source electrode and the drain electrode are both in electrical contact with the two-dimensional electron gas.

The present disclosure provides a non-planar hole channel transistor and a fabrication method thereof. The non-planar hole channel transistor has a substrate, and a surface of the substrate has a step structure comprising a vertical surface. A non-planar channel layer is epitaxially grown laterally with the vertical surface as a core. A barrier layer is formed on the channel layer, so as to simultaneously form a two-dimensional hole gas and/or a two-dimensional electron gas at an interface between the barrier layer and the channel layer.

The present disclosure relates to a semiconductor device and a fabrication method thereof. The semiconductor device includes a substrate, a first nitride semiconductor layer on the substrate and a second nitride semiconductor layer on the first nitride semiconductor layer. The second nitride semiconductor layer has a first area and a second area, and the second nitride semiconductor layer has single crystals. The semiconductor device includes an electrode in contact with the first area. A first concentration of Aluminum (Al) of the first area is less than a second concentration of Al of the second area, and the single crystals in the first area take over a crystal structure of the first nitride semiconductor layer.

A transistor device includes a semiconductor structure, source and drain contacts on the semiconductor structure, a gate on the semiconductor structure between the source and drain contacts, and a surface passivation layer on the semiconductor structure between the gate and the source or drain contact. The surface passivation layer includes an opening therein that exposes a first region of the semiconductor structure for processing the first region differently than a second region of the semiconductor structure adjacent the gate. Related devices and fabrication methods are also discussed.