A display substrate, a method for manufacturing the same, and a display device are provided, belonging to the technical field of display. The display substrate includes: a base substrate; a thin film transistor on the base substrate, the thin film transistor including an active layer and a gate electrode on one side of the active layer away from the base substrate, an orthographic projection of the gate electrode on the base substrate at least partially overlapping with an orthographic projection of the active layer on the base substrate; and a conductive pattern arranged on a layer different from the gate electrode, the conductive pattern and the gate electrode being separated by an insulating layer, the orthographic projection of the gate electrode on the base substrate at least partially overlapping with an orthographic projection of the conductive pattern on the base substrate. The technical solution of the present disclosure can improve the yield of OLED display substrates.

An active matrix substrate is provided with a plurality of oxide semiconductor TFTs including a plurality of first TFTs. An oxide semiconductor layer of each oxide semiconductor TFT includes a channel region, a source contact region, and a drain contact region. In a view from a normal direction of the substrate, the channel region is a region located between the source contact region and the drain contact region and overlapping a gate electrode, and the channel region includes a first end portion and a second end portion that oppose each other and extend in a first direction from the source contact region side toward the drain contact region side, a source side end portion that is located on the source contact region side of the first and second end portions and extends in a second direction that intersects the first direction, and a drain side end portion that is located on the drain contact region side of the first and second end portions and extends in the second direction. Each first TFT further includes a light blocking layer located between the oxide semiconductor layer and the substrate. In a view from the normal direction of the substrate, the light blocking layer includes an opening region that overlaps part of the channel region and a light blocking region that overlaps another part of the channel region. In a view from the normal direction of the substrate, the light blocking region includes a first light blocking portion that extends in the first direction over the first end portion of the channel region and a second light blocking portion that extends in the first direction over the second end portion of the channel region; each of the first light blocking portion and the second light blocking portion includes a first edge portion and a second edge portion that oppose each other and extend in the first direction; at least part of the first edge portion overlaps the channel region; and the second edge portion is located on an outer side of the channel region and does not overlap the channel region.

A light emitting device, includes: a substrate; a light emitting element on the substrate, the light emitting element having a first end portion and a second end portion arranged in a longitudinal direction; one or more partition walls disposed on the substrate, the one or more partition walls being spaced apart from the light emitting element; a first reflection electrode adjacent the first end portion of the light emitting element; a second reflection electrode adjacent the second end portion of the light emitting element; a first contact electrode connected to the first reflection electrode and the first end portion of the light emitting element; an insulating layer on the first contact electrode, the insulating layer having an opening exposing the second end portion of the light emitting element and the second reflection electrode to the outside; and a second contact electrode on the insulating layer.

A display device includes a base substrate including a first substrate and a second substrate sequentially laminated, a lower semiconductor layer disposed on at least one of the first substrate and the second substrate, a buffer layer disposed on the base substrate, an active semiconductor layer disposed on the buffer layer and including a first active layer of a first transistor and a second active layer of a second transistor, a first insulating layer disposed on the active semiconductor layer, and a first conductive layer disposed on the first insulating layer and including a first gate electrode of the first transistor and a second gate electrode of the second transistor, wherein the lower semiconductor layer overlaps the first active layer, and does not overlap the second active layer.

A display device including a substrate, a gate line, a data line, a plurality of thin film transistors, a first pixel electrode, and a second pixel electrode. The gate line is disposed on the substrate. The data line is disposed on the substrate. The data line includes a first branch line and a second branch line. The first branch line and the second branch line form a closed loop. The plurality of thin film transistors is connected to the data line. The first pixel electrode is connected to at least one of the plurality of thin film transistors. The second pixel electrode is connected to at least another one of the plurality of thin film transisters. The first pixel electrode and the second pixel electrode are arranged in a substantially diagonal direction with respect to each another. The first branch line is connected to a source electrode of said at least one of the plurality of thin film transistors. The second branch line is connected to a source electrode of said at least another one of the plurality of thin film transistors.

Embodiments of the invention provide an array substrate, a display device and a manufacturing method of the array substrate. The array substrate comprises a substrate (10) and a plurality of electrostatic discharge short-circuit rings (20) provided on the substrate. Each of the electrostatic discharge short-circuit rings (20) comprises a gate electrode (22), a gate insulating layer (26), an active layer (21), a source electrode (23), a drain electrode (24) and a passivation layer (30). Each of the electrostatic discharge short-circuit ring (20) further comprises a transparent conductive layer (25) for connecting the gate electrode (22) and the drain electrode (24), and the transparent conductive layer (25) is provided below the passivation layer (30).

According to one embodiment, a semiconductor device includes contact holes passing through a source region of a drain region of an interlayer insulating film and oxide semiconductor layer to reach an insulating substrate, wherein a source electrode and a drain electrode are formed inside the contact holes, respectively.

An organic light emitting display device includes a driving TFT on the substrate, a switching TFT on the substrate, and an organic light emitting diode. The driving TFT includes a first active layer formed of poly-Si, and at least a first part of an interlayer insulation layer on the first active layer. The interlayer insulation layer is formed of a first material including hydrogen. The switching TFT includes a second active layer, at least a second part of the interlayer insulation layer between the first active layer and the second active layer, and at least a part of a gate insulation layer between the second part of the interlayer insulation layer and the second active layer. The gate insulation layer is formed from a second material different from the first material and blocking diffusion of hydrogen from the interlayer insulation layer to the second active layer.

The semiconductor device comprises a gate electrode, a first gate insulating film overlapping a part of the side surface and the upper surface of the gate electrode, a second gate insulating film overlapping the upper surface of the gate electrode, a semiconductor film provided on the upper surface of the second gate insulating film and overlapping the gate electrode and a first terminal and a second terminal overlapping the upper surface of the semiconductor film. In a plan view, a first region is a region where the semiconductor film overlaps the upper surface of the first gate insulating film and the second gate insulating film between the first terminal and the second terminal, and a third region is a region that overlaps both a part of the upper surface of the gate electrode and the second gate insulating film and does not overlap the first gate insulating film.

An object is to provide a display device which operates stably with use of a transistor having stable electric characteristics. In manufacture of a display device using transistors in which an oxide semiconductor layer is used for a channel formation region, a gate electrode is further provided over at least a transistor which is applied to a driver circuit. In manufacture of a transistor in which an oxide semiconductor layer is used for a channel formation region, the oxide semiconductor layer is subjected to heat treatment so as to be dehydrated or dehydrogenated; thus, impurities such as moisture existing in an interface between the oxide semiconductor layer and the gate insulating layer provided below and in contact with the oxide semiconductor layer and an interface between the oxide semiconductor layer and a protective insulating layer provided on and in contact with the oxide semiconductor layer can be reduced.