A semiconductor manufacturing apparatus of the present disclosure includes a semiconductor module having a semiconductor device, a sealing material adapted to seal the semiconductor module, and a second terminal to be arranged outside the sealing material. The semiconductor module includes a first terminal electrically connected to the semiconductor device and extending to the outside of the sealing material. The first terminal is joined to the second terminal outside the sealing material. The thickness of the second terminal in a direction perpendicular to a joined face of the first terminal and the second terminal is defined as the thickness of the second terminal. The thickness of the first terminal at a portion extending from the sealing material in the direction perpendicular to the joined face is defined as the thickness of the first terminal. The thickness of the second terminal is greater than the thickness of the first terminal.