A chip bonding apparatus includes a stage configured to support a plurality of substrates, a bonding head located to face an upper surface of the stage in a vertical direction and configured to hold a plurality of semiconductor chips and transmit a laser beam, and a laser irradiating unit configured to irradiate a laser beam toward the semiconductor chips, wherein a plurality of trenches are formed in a lower surface of the bonding head.

An apparatus and method for establishing a contact connection between at least one connection contact of a substrate and at least one connection contact of a semiconductor component, a conductor material web being formed on the substrate and the semiconductor component. The apparatus includes a joining tool for positioning and joining the semiconductor component on/to the substrate, a beam channel for optical radiation being formed within the joining tool, a laser device for applying laser radiation to the substrate and/or to the semiconductor component, a detection device for detecting optical radiation, and a substrate receptacle on which the substrate is fixed in place and with which at least one underside of the substrate can be brought into contact. An optical window having an optically transparent window body is incorporated in the substrate receptacle for the unobstructed passage of optical radiation into and/or out of the substrate, the optical window being disposed in a beam path of the laser device and/or in a beam path of the detection device.

A laser assisted bonding device and a method for bonding a semiconductor die onto a substrate are provided. The laser assisted bonding device comprises: a compression bonding mechanism, wherein the compression bonding mechanism comprises: a compression base comprising a vacuum passage extending through the compression base and fluidly connected with a vacuum source; and a compression head attached to the compression base, wherein the compression head comprises a plurality of blocks, and a plurality of grooves separating the plurality of blocks from each other and being fluidly connected with the vacuum passage, and wherein a size of a block decreases with a distance of the block to the vacuum passage; and a laser source configured for emitting a laser beam to heat solder bumps between the semiconductor die and the substrate.

An apparatus for manufacturing a power semiconductor device with power semiconductors contacted on both sides has a receiver for a fundamental assembly that is to be sintered, which has a lower contact module, a power semiconductor, and sintering compound therebetween; a stamping unit that has a stamp for exerting a predefined pressure on the fundamental assembly to generate a sintered bond between the lower contact module and the power semiconductor; and a measuring device for determining the height of an upper surface of the power semiconductor above the lower contact module after the sintering. Also disclosed are a method for manufacturing a power semiconductor device with power semiconductors contacted on both sides, and a power semiconductor device.

A fluid dispensing apparatus includes a workpiece carrier configured to carry a workpiece thereon, a dispensing nozzle disposed at a side of the workpiece carrier and configured to dispense a fluid toward the workpiece along a flow path, a light source disposed at a side of the flow path for emitting light passing through the flow path, a sensor positioned to sense the light from the light source and generating a sensing signal accordingly, and a processor coupled to the sensor and configured to determine an operation status of the dispensing nozzle according to the sensing signal.

A method for forming an electronic device is provided. The method comprises: providing a light pervious carrier having on its front surface an auxiliary layer; forming conductive patterns on the auxiliary layer; disposing at least one electronic component on at least a portion of the conductive patterns via solder bumps; exposing the auxiliary layer to a light source through the light pervious carrier to heat the auxiliary layer and reflow the solder bumps; forming a mold cap on the auxiliary layer to encapsulate the conductive patterns and the at least one electronic component to form the electronic device; and removing the auxiliary layer and the light pervious carrier from the electronic device to expose the conductive patterns.