Structured photovoltaic assemblies and method of manufacture therefor. The assemblies can be assembled similar to flex circuits and have mechanical support structures disposed within the assembly. The supports can be sized and shaped to one or a group of solar cells in the assembly. The solar cells supported by a particular support may be interconnected with cells supported by a different support. The supports can be transparent. The connection of the interconnects to the solar cells can be enhanced by forming protrusions in vias through openings in the Insulating layer that are aligned with the solar cells. Alternatively, the openings can be filled with a conductive material in such forms as powder, ink, paste, or metal nanoparticles, and a laser can be used to melt and/or sinter the material to form the connection to the solar cell. These techniques can withstand large temperature swings over a large number of cycles, which occur in, for example, space applications.

Wood fibers possess natural unique hierarchical and mesoporous structures that enable a variety of new applications beyond their traditional use. For the first time we dramatically modulate the propagation of light through random network of wood fibers. A highly transparent and clear paper with transmittance >90% and haze <1.0% applicable for high-definition displays is achieved. By altering the morphology of the same wood fibers that form the paper, highly transparent and hazy paper targeted for other applications such as solar cell and anti-glare coating with transmittance >90% and haze >90% is also achieved. A thorough investigation of the relation between the mesoporous structure and the optical properties in transparent paper was conducted, including full-spectrum optical simulations. We demonstrate commercially competitive multi-touch touchscreen with clear paper as a replacement for plastic substrates, which shows excellent process compatibility and comparable device performance for commercial applications. Transparent cellulose paper with tunable optical properties is an emerging photonic material that will realize a range of much improved flexible electronics, photonics and optoelectronics.

A method for manufacturing a flexible photovoltaic panel to be fixed to a double curvature support surface is provided. The method includes generating a numerical model of a flat structure that is curved to conform to the double curvature support structure, identifying, in the flat structure, compression zones subject to formation of creases or lifting as a result of a curvature imposed by the double curvature support surface, determining a pattern of photovoltaic cells to be arranged on the flat structure, producing a flat photovoltaic panel on the basis of the pattern of photovoltaic cells, and forming cut-outs in the compression zones, the cut-outs being configured to close as a result of the curvature imposed by the double curvature support surface.

A solar electrical generator comprising an outer wall (1, 2) arranged to partially surround a cavity. A hub (3) is provided within the cavity wherein the outer face (4) of the wall is provided with solar cells (5). At least one of the hub (3) and the inner face (6) of the wall are provided with solar cells (5).

An apparatus is disclosed for transferring a pattern of a composition containing particles of an electrically conductive material and a thermally activated adhesive from a surface of a flexible web to a surface of a substrate. The apparatus comprises: respective drive mechanisms for advancing the web and the substrate to a nip through which the web and the substrate pass at the same time and where a pressure roller acts to press the surfaces of the web and the substrate against one another, a heating station for heating at least one of the web and the substrate prior to, or during, passage through the nip, to a temperature at which the adhesive in the composition is activated, a cooling station for cooling the web after passage through the nip, and a separating device for peeling the web away from the substrate after passage through the cooling station, to leave the pattern of composition adhered to the surface of the substrate.

A flexible assembly with a stainless steel mesh packaging structure includes a flexible back plate, a first hot melt adhesive, a solar cell string, a stainless steel mesh, a second hot melt adhesive, and a flexible front plate. The flexible back plate and the flexible front plate are respectively arranged on the outer surface of the first hot melt adhesive and the outer surface of the second hot melt adhesive, and the solar cell string and the stainless steel mesh are arranged between the first hot melt adhesive and the second hot melt adhesive. The stainless steel mesh is arranged at partial or all positions around the outer edge of the solar cell string and is continuously distributed or separately distributed. The stainless steel mesh is arranged around the solar cell string to further strengthen the strength of the flexible assembly and improve the tearing resistance of the flexible assembly.

An electronic component comprising: an electronic substrate that includes an electronic element and a first connection terminal a package member that is disposed on the electronic substrate; and a circuit member that includes a second connection terminal, wherein the circuit member is disposed between the package member and the electronic substrate, and extends from the position between the package member and the electronic substrate outward beyond the edge of the electronic substrate; the electronic component includes a connecting member that is disposed between the circuit member and the electronic substrate, and electrically connects the second connection terminal and the first connection terminal, an adhesive member that is disposed between the circuit member and the package member, and joins the circuit member to the package member; the connecting member, the circuit member, and the adhesive member are located between the package member and the electronic substrate.

An optoelectronic device includes a flexible substrate, a cerium oxide (CeO.sub.2) layer arranged on the flexible substrate, a single crystal β-III-oxide layer arranged on the CeO.sub.2 layer, and a metallic contact layer arranged on the single crystal β-III-oxide layer.

An electronic component comprising: an electronic substrate that includes an electronic element and a first connection terminal a package member that is disposed on the electronic substrate; and a circuit member that includes a second connection terminal, wherein the circuit member is disposed between the package member and the electronic substrate, and extends from the position between the package member and the electronic substrate outward beyond the edge of the electronic substrate; the electronic component includes a connecting member that is disposed between the circuit member and the electronic substrate, and electrically connects the second connection terminal and the first connection terminal, an adhesive member that is disposed between the circuit member and the package member, and joins the circuit member to the package member; the connecting member, the circuit member, and the adhesive member are located between the package member and the electronic substrate.

A photodetection device includes a substrate and a plurality of pixel units. The plurality of pixel units includes a pixel unit including a first photodetector in an active area, and a pixel unit including a second photodetector in an inactive area. The first photodetector includes a first lower electrode layer, a first lower extrinsic semiconductor layer, a first intrinsic semiconductor layer, a first upper extrinsic semiconductor layer, and a first upper electrode layer. The second photodetector includes a second lower electrode layer, a second lower extrinsic semiconductor layer, a second intrinsic semiconductor layer, a second upper extrinsic semiconductor layer, and a second upper electrode layer. The second lower electrode layer is covered with the second lower extrinsic semiconductor layer and the second intrinsic semiconductor layer.