Disclosed are an array substrate and a preparation method thereof, and a digital microfluidic chip. The preparation method includes: forming a plurality of photoelectric detection devices on a silicon-based substrate; transferring the photoelectric detection devices to a base substrate by adopting a micro transfer printing process; and forming a plurality of transparent driving electrodes on the base substrate, wherein the transparent driving electrodes are insulated from the photoelectric detection devices.

A method for thermally activating a passivation layer disposed on a photovoltaic cell. The photovoltaic cell includes a first face, a second face opposite to the first face, and side surfaces connecting the first and second faces. The passivation layer covers at least one of the side surfaces of the photovoltaic cell. The method includes exposing the first face to electromagnetic radiation emitted by a radiation source. The electromagnetic radiation is applied to the first face along a line. The line sweeps at least part of the first face and is oriented relative to the first face so as to provide an overheating zone encompassing at least part of the passivation layer.

Solar devices and methods for producing solar devices are disclosed. In some examples, a solar device includes solar cells arranged in a shingled manner such that adjacent long edges of adjacent ones of the solar cells overlap. The adjacent long edges have a non-linear shape that has protruding portions. The solar device includes contact pads arranged in the protruding portions of the adjacent long edges such that the contact pads of the adjacent ones of the solar cells are electrically connected.

A flexible and rollable back-contact solar cell module, wherein a length of it can be extended infinitely and the back-contact solar cell module includes a plurality of large cell blocks connected in series or in parallel. The large cell block includes a plurality of small cell strings connected in series or in parallel. The small cell string includes a plurality of small square cell pieces connected in series or in parallel. The series-connection or the parallel-connection between the large cell blocks, the small cell strings, or the small square cell pieces is achieved by welding a flexible interconnected bar in the horizontal or vertical direction. Electrodes of the small square cell pieces are all on a back side and the small square cell pieces are formed by cutting a back-contact solar cell. A protective layer is attached to a surface of a light-receiving side by using an adhesive layer.

A photovoltaic panel having a distributed support frame adhered to a photovoltaic module is described. For example, the distributed support frame may include one or more support member or support mounts adhered to the photovoltaic module by an adhesive layer. The photovoltaic module may include layers bound together by an encapsulant. Accordingly, the distributed support frame may be attached to the photovoltaic module during a same lamination process used to laminate the photovoltaic module.

A photovoltaic panel having a distributed support frame adhered to a photovoltaic module is described. For example, the distributed support frame may include one or more support member or support mounts adhered to the photovoltaic module by an adhesive layer. The photovoltaic module may include layers bound together by an encapsulant. Accordingly, the distributed support frame may be attached to the photovoltaic module during a same lamination process used to laminate the photovoltaic module.

A solar power system may comprise a back sheet that comprises an interconnect circuit coupling a plurality of cell tiles. A tiled solar cell, comprising a solar cell and encapsulating and glass layers, is inserted into the cell tiles of the back sheet. Each solar cell is individually addressable through the use of the interconnect circuit. Moreover, the interconnect circuit of the back sheet is programmable and allows for dynamic interconnect routing between solar cells.

The present disclosure relates to large cell sheets, solar cells, shingled solar modules, and manufacturing method thereof. A top surface of a boundary portion of units of the large cell sheet is divided into a cutting area, top surface bonding areas and top surface electrically-conductive contact areas. The cutting area is configured in a way that the large cell sheet can be cut along the cutting area; the top surface bonding areas and the top surface electrically-conductive contact areas are provided alternately, the cutting area and the top surface electrically-conductive contact areas are formed as an overlapping edge of the solar cell, and after the splitting of the large cell sheet, the top surface electrically-conductive contact areas can directly contact the bottom surface of another solar cell to achieve electrically-conductive connection. The large cell sheet according to the present disclosure can be split conveniently, and the individual solar cells are provided with dedicated bonding areas and electrically-conductive contact areas. Such an arrangement can optimize the production process and use performance of the solar cells.

An apparatus for producing semiconductor cells, the apparatus comprises a printing device for printing on a semiconductor cell, a monitoring device configured to monitor characteristics of the printed semiconductor cell, and a cleaning device configured for cleaning at least one part of the printing device based on the monitored characteristics of the semiconductor cells.

A system for wafer processing, includes: a frame comprising a frame opening; and a membrane configured to couple to the frame and to cover at least a part of the frame opening, the membrane comprising a membrane opening, wherein the membrane opening has a membrane opening area that is equal to or less than a frame opening area of the frame opening; wherein the membrane is configured for coupling with the wafer, wherein when the wafer is coupled with the membrane, the wafer covers the membrane opening, and wherein the membrane is configured to maintain the wafer at a certain position with respect to the frame; and wherein the membrane opening area is less than a total area of the wafer.