First, first cell wiring members from the first solar cell and second cell wiring members from the second solar cell are sandwiched between a wiring member film and a second bridge wiring member. Subsequently, the first cell wiring members and the second cell wiring members are connected to the second bridge wiring member by applying heat to at least the first cell wiring members, the second cell wiring members, and the second bridge wiring member by induction heating.

The present disclosure provides an electronic package. The electronic package includes a substrate, a first electronic component, an encapsulant, and a shielding layer. The substrate has a first upper surface, a second upper surface, and a first lateral surface extending between the first upper surface and the second upper surface. The first electronic component is disposed on the substrate. The encapsulant coves the first electronic component and the first lateral surface of the substrate. The shielding layer covers the encapsulant. The shielding layer is spaced apart from the first lateral surface of the substrate.

The invention to a method of making an interconnector assembly for electrically interconnecting solar cells, wherein the method comprises: feeding a plurality of (preferably elongated) electrical conductors that form an conductor array defining interspaces that are free from conductors; and applying at least one sheet, preferably made of electrically insulating material, to a side of the conductor array, wherein the sheet has at least one contact zone coming into contact with the conductors and intermediate portions overlapping with the interspaces of the conductor array. The invention also refers to an apparatus for fabricating an interconnector assembly for electrically interconnecting solar cells and to a rotatable heating drum.

The present invention provides methods and systems for manufacturing process control of photovoltaic products. Some embodiments relate to a method for tracking wafers for photovoltaic products with respect to which production tool processed them and their position within that production tool. Some embodiments relate to measuring and characterizing the critical-to-quality parameters of the partially-finished photovoltaic products emerging from the production tool in question. Some embodiments relate to display and visualization of the measured parameters on a computer screen, such that the parameters of each production unit can be directly observed in the context of which production tools processed them, which location within a specific production tool they were located in during processing, and which batch, or in the case of continuous processing, what time, the unit(s) was/where processed.

A solar cell module capable of preventing the occurrence of a PID failure in a solar photovoltaic power generation system with a MW capacity, said system being used in a high-temperature high-humidity environment; and a method for manufacturing this solar cell module. A solar cell module which comprises a protection glass material and a sealing material on a light receiving surface side of a substrate, and which also comprises an oxide layer between the substrate and the protection glass material, said oxide layer containing a metal element and silicon. It is preferable that the oxide layer contains at least one metal element selected from the group consisting of magnesium, aluminum, titanium, vanadium, chromium, manganese, zirconium, niobium and molybdenum. It is also preferable that the oxide layer has a refractive index of from 1.5 to 2.3 (inclusive) with respect to incident light having a wavelength of 587 nm.

A flexible laminate of photovoltaic cells is provided, including a layer of photovoltaic cells that are connected to one another; a front layer and a back layer configured to encapsulate the layer of photovoltaic cells; and an outer film of flexible material with anti-soiling properties disposed on the front layer, the outer film having an average roughness that is less than 1 μm. There is also provided a method for decreasing or limiting soiling on a surface of a flexible laminate of photovoltaic cells, the method including applying an outer film of flexible material with anti-soiling properties to the front layer, the outer film having an average roughness that is less than 1 μm.

A method for fabricating an image sensor array having a first group of photodiodes for detecting light at visible wavelengths a second group of photodiodes for detecting light at infrared or near-infrared wavelengths, the method including forming a germanium-silicon layer for the second group of photodiodes on a first semiconductor donor wafer; defining a first interconnect layer on the germanium-silicon layer; defining integrated circuitry for controlling pixels of the image sensor array on a semiconductor carrier wafer; defining a second interconnect layer on the semiconductor carrier wafer; bonding the first interconnect layer with the second interconnect layer; defining the pixels of an image sensor array on a second semiconductor donor wafer; defining a third interconnect layer on the image sensor array; and bonding the third interconnect layer with the germanium-silicon layer.

Method of manufacturing a single-side-contacted photovoltaic device (1), comprising the steps of: a) providing a photovoltaically-active substrate (3) defining a plurality of alternating hole collecting zones (3a) and electron collecting zones (3b) arranged in parallel strips; b) depositing a conductive layer (5) across said zones; c) depositing at least one conductive track (9) extending along at least part of each of said zones (3a, 3b); d) selectively forming a dielectric layer (7) on each of said zones (3a, 3b), so as to leave an exposed area free of dielectric at an interface between adjacent zones (3a, 3b); e) etching said conductive layer (5) in said exposed areas; f) applying a plurality of interconnecting conductors (11a, 11b) so as to electrically interconnect at least a portion of said hole collecting zones (3a) with each other, and to electrically interconnect at least a portion of said electron collecting zones (3b) with each other.

A solar panel cutting unit according to an embodiment can separate layers of a solar panel from each other at once. The solar panel cutting unit separates thin layers of a solar panel from each other and includes a frame, a panel transporting mechanism that is provided at the frame and lowers the solar panel in a vertical direction such that adhesion lines of the thin layers are arranged downward, a pair of guide roller units that is positioned below the panel transporting mechanism and guides and lowers the solar panel, and a wire cutting mechanism that includes a pair of support rollers and cutting wires which connect the support rollers to each other and extend in the same direction as the adhesion lines such that the wire cutting mechanism separates the thin layers of the solar panel from each other.

A semiconductor wafer is as wide as the industry standard width A (presently 156 mm+/−1 mm) and is longer than the industry standard A by at least 1 mm and as much as the standard equipment can reasonably accommodate, presently approximately 3-20 mm and potentially longer, thus, gaining significant additional surface area for sunlight absorption. Modules may be composed of a plurality of such larger wafers. Such wafers can be processed in conventional processing equipment that has a wafer retaining portion of industry standard size A and a configuration that also accommodates a wafer with a perpendicular second edge longer than A by at least 1 and typically 3-20 mm. Wet bench carriers and transport and inspection stations can be so used.