A black matrix substrate assembly including a transparent substrate, a black matrix pattern, a transparent resin layer, a resin wall pattern, a light reflective layer, and a transparent protective layer. The black matrix pattern includes first and second black linear segments with a width Ax of each first segment in a first direction. The resin wall pattern includes first and second wall linear segments with a width Dx of each first segment smaller than the width Ax in the first direction and the center line of each first segment aligned with that of the corresponding first black linear segment. The light reflective layer includes first and second reflective linear segments with a width Cx of each first segment larger than the width Dx in the first direction and the center line of each first segment aligned with that of the corresponding first black linear segment.

A display device includes a substrate, a first light-emitting element, a second light-emitting element, and a third light-emitting element on the substrate, each of the first, second, and third light-emitting elements includes a first semiconductor layer, an active layer, a second semiconductor layer, and a third semiconductor layer, an opening formed in the second semiconductor layer and the third semiconductor layer of the third light-emitting element, and a wavelength conversion member located at the opening, wherein the first light-emitting element and the third light-emitting element are configured to emit first light, and the second light-emitting element is configured to emit second light, and the wavelength conversion member is configured to convert the first light from the third light-emitting element into third light.

A package includes a first lead including a first electrode terminal, a second lead including a second electrode terminal, a first molded body holding the first lead, and a second molded body holding the second lead. The second lead is provided on the first lead in an overlapping direction such that the first electrode terminal of the first lead overlaps with the second electrode terminal of the second lead when viewed in the overlapping direction. The first electrode terminal and the second electrode terminal are electrically connected to each other without adding additional material. A part of the first molded body and a part of the second molded body are in contact with each other.

The present disclosure provides a light emitting device including a substrate, a conductive layer, first and second reflective layers, a light emitting element, and an encapsulation layer. The conductive layer is disposed on the substrate. The first reflective layer covers the conductive layer and has an opening exposing a portion of the conductive layer. The light emitting element is disposed in the opening and electrically connects to the conductive layer. The second reflective layer is disposed on the first reflective layer and surrounds the light emitting element, and the second reflective layer has an outer diameter. The encapsulation layer covers the light emitting element. There is a height between a highest point of the encapsulation layer and an upper surface of the first reflective layer, and the height is 0.1 to 0.5 times the outer diameter. The present disclosure also provides a backlight and a display panel.

A device including a phosphor layer having a plurality of holes or pockets arranged within the phosphor layer to reduce lateral light transmission. The phosphor layer can be sized and positioned to extend over a plurality of LED emitter pixels.

A display device may include a substrate including a display area and a non-display area; pixels disposed in the display area; first and second driving voltage lines disposed in the non-display area and spaced apart from each other; a first fan-out line disposed in the non-display area and electrically connected to the first driving voltage line; a second fan-out line disposed in the non-display area and electrically connected to the second driving voltage line; a first power line including at least two first sub-power lines branching off to a corresponding one of the pixels from the first fan-out line; and a second power line including at least two second sub-power lines branching off to a corresponding one of the pixels from the second fan-out line.

A wavelength conversion element according to the present disclosure includes a wavelength conversion layer having a first surface having a recessed part, and a plurality of air holes, and configured to be excited by light in a first wavelength band to thereby generate light in a second wavelength band different from the first wavelength band, a particle disposed in the recessed part, a light transmissive member disposed so as to cover the recessed part and the particle, a reflecting layer disposed so as to be opposed to the first surface of the wavelength conversion layer, and a base member disposed so as to be opposed to the reflecting layer.

A semiconductor light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED structures are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED structures. Each of the LED structures includes a first electrode and a second electrode. Light emitted from at least one of the LED structures passes through the transparent substrate and emerges from the second main surface. An illumination device includes the semiconductor light emitting element and a supporting base. The semiconductor light emitting element is disposed on the supporting base, and an angle is formed between the semiconductor light emitting element and the supporting base.

The invention provides a lighting device (10) comprising a light source (100) configured to generate light source light (101) and a light converter element (200), wherein the light converter element (200) comprises a light transmissive matrix (205), wherein the light transmissive matrix (205) comprises: (i) a first luminescent material (210) configured to convert at least part of one or more of (a) the light source light (101) and (b) optionally a second luminescent material light (221) from an optional second luminescent material (220) into a first luminescent material light (211); and (ii) a thermo-responsive liquid crystalline compound (250); wherein the light transmissive matrix (205) is configured in thermal contact with the light source (100), and wherein the lighting device (10) is further configured to provide lighting device light (11) comprising said light source light (101), said first luminescent material light (210) and optionally said second luminescent material light (221), and wherein said light converter element is arranged for changing one or more of the color and color temperature of the lighting device light with the electrical power provided to the light source.

To provide a quantum dot and manufacturing method of the dot particularly capable of reducing organic residues adhering to the quantum dot surface and of suppressing the black discoloration occurrence of a layer including the quantum dot positioned immediately above a light emitting device, and a compact, sheet member, wavelength conversion member and light emitting apparatus with high luminous efficiency using the quantum dot, a quantum dot of the present invention has a core portion including a semiconductor particle, and a shell portion with which the surface of the core portion is coated, and is characterized in that a weight reduction up to 490° C. is within 75% in a TG-DTA profile. Further, the quantum dot of the invention is characterized in that oleylamine (OLA) is not observed in GC-MS qualitative analysis at 350° C.