A MEMS component having increased integration density and a method for manufacturing such a component are specified. The component comprises a base wafer and a cover wafer arranged over this. A first cavity is arranged between the base wafer and the cover wafer. A second cavity is arranged over the cover wafer, below a thin-layer covering. The cavities contain component structures.

Provided is a piezoelectric element vibration apparatus that generates vibration by applying a driving voltage to a piezoelectric vibrator, wherein a piezoelectric element layer is arranged on an electrode substrate made of a conductive material, an insulation member for preventing the applied driving voltage from leaking is formed on the piezoelectric element layer, and the piezoelectric element vibration apparatus has various types of forms in order to attach and install the piezoelectric vibrator. As a result, the piezoelectric element vibration apparatus has the effects wherein: installation is possible simply by attachment, thereby simplifying the assembly process; installation in any position is possible because the thickness of the piezoelectric element vibration device is made to be thin; the vibration volume can increase and the vibration noise can decrease while minimizing the thickness.

A flexible sensor is provided which has a flexible substrate of polymeric material, a bottom electrode layer arranged on the flexible substrate and configured to be a reference electrode, an active layer of piezoelectric material arranged on the bottom electrode layer, a top electrode layer arranged on the active layer and configured to be connected to a signal conductor, and a flexible coating layer of polymeric material that cooperates with the flexible substrate to encapsulate the bottom electrode layer, the active layer, and the top electrode layer. The flexible sensor has an additional layer of metal material arranged on the flexible coating layer and short-circuited to the bottom electrode layer, the additional layer and the bottom electrode layer acting as an electromagnetic shield for the flexible sensor.

The present description concerns a clock signal generation device (902) comprising: a microelectromechanical resonant element (504); and at least one nanoelectromechanical transduction element (512).

A resonator device includes a base, a resonator element attached to the base, a cover accommodating the resonator element between the base and the cover, and a conductive bonding member positioned between the base and the cover and bonding the base to the cover. The base includes a resonator element mount surface on which the resonator element is attached, a first interconnect and a second interconnect that are arranged on the resonator element mount surface and that are electrically coupled to the resonator element, a bonding surface bonded to the cover through the bonding member, and a step between the resonator element mount surface and the bonding surface.

A piezoelectric energy hunting device and a voltage signal application system thereof are disclosed. The piezoelectric energy hunting device includes a plurality of curved piezoelectric elements, a plurality of rigid foams, and a flexible foam structure. The plurality of curved piezoelectric elements are arranged side by side with one another, wherein each curved piezoelectric element is attached to one of the rigid foams. The flexible foam structure includes a top foam and a bottom foam covering the outer surface of the plurality of curved piezoelectric elements and the plurality of rigid foams; when the flexible foam structure is compressed, the plurality of curved piezoelectric elements are simultaneously deformed, thereby generating a voltage signal. When the flexible foam structure is not compressed, the flexible foam structure and the plurality of rigid foams provide an elastic force to restore the plurality of curved piezoelectric elements.

An ultrasonic device includes: a substrate provided with a first opening and a second opening; a support film that is provided on the substrate and blocks the first opening and the second opening; a transmitting piezoelectric film that is provided on the support film at a position which overlaps the first opening when viewed in a thickness direction of the substrate and is interposed between a pair of electrodes in the thickness direction of the substrate; and a receiving piezoelectric film that is provided on the support film at a position which overlaps the second opening when viewed in the thickness direction of the substrate and is interposed between a pair of electrodes in the thickness direction of the substrate. In the thickness direction of the substrate, a thickness dimension of the transmitting piezoelectric film is smaller than a thickness dimension of the receiving piezoelectric film.

A method for forming a high resistivity handle substrate for a composite substrate comprises: providing a base substrate made of silicon; exposing the base substrate to a carbon single precursor at a pressure below atmospheric pressure to form a polycrystalline silicon carbide layer having a thickness of at least 10 nm on the surface of the base substrate; and then growing a polycrystalline charge trapping layer on the carbon-containing layer.

The disclosure provides a piezoelectric element and a method for manufacturing a piezoelectric element. The disclosure provides the piezoelectric element comprising: a base layer, a piezoelectric layer which is disposed on one surface of the base layer, and in which upwardly curved convex portions and downwardly curved concave portions are continuously disposed along a first direction; and contact members which are disposed on the concave portions of the piezoelectric layer and on the one surface of the base layer to connect the piezoelectric layer to the base layer.

A driving mechanism is provided, including a base, a movable module, and a driving assembly. The movable module has a movable member and a connecting member connected to the movable member. The driving assembly is connected to the base and the connecting member. The driving assembly has a driving element that generates a driving force to the connecting member and the movable member, so that the movable module moves relative to the base.