A multi-channel filter with a PCB with a first side with signalling tracks and shielding tracks between neighbouring signalling tracks. On the second side, a conductive layer is provided. The signalling tracks are covered by an electromagnetically absorbing material, such as a powder of an electrically conducting material is provided. The filter may have sections with reversed structure where the conductors are on the second side and the layer on the first side, where the conductors on opposite sides are interconnected. The filter may be rolled or folded.

A high-speed circuit includes a printed circuit board, a ground plane layer, a pair of first and second differential traces, and a cascading common mode filter. The printed circuit board has a first surface and an opposite second surface. The ground plane layer has a first surface in contact with the second surface of the printed circuit board. The pair of first and second differential traces are on the first surface of the printed circuit board. The first and second differential traces carry an electrical signal. The cascading common mode filter includes an outer and an inner common mode filter. The outer common mode filter includes a U-shaped void section on the first surface of the ground plane layer. The inner common mode filter includes an H-shaped void section on the first surface of the ground plane layer. The H-shaped void section is located proximate to the U-shaped void section.

A high-speed circuit includes a printed circuit board, a ground plane layer, a pair of first and second differential traces, and a cascading common mode filter. The printed circuit board has a first surface and an opposite second surface. The ground plane layer has a first surface in contact with the second surface of the printed circuit board. The pair of first and second differential traces are on the first surface of the printed circuit board. The first and second differential traces carry an electrical signal. The cascading common mode filter includes an outer and an inner common mode filter. The outer common mode filter includes a U-shaped void section on the first surface of the ground plane layer. The inner common mode filter includes an H-shaped void section on the first surface of the ground plane layer. The H-shaped void section is located proximate to the U-shaped void section.

Antenna and/or waveguide assemblies for vehicles, such as RADAR sensor antenna assemblies, along with associated signal confinement structures. In some embodiments, the assembly may comprise an antenna block defining one or more waveguides. A conductive layer may be coupled to the antenna block to form, at least in part, a wall of the waveguide. The assembly may comprise one or more periodic structures that may be operably coupled to the waveguide, each of which may comprise a first elongated opening and a first series of repeated slots extending at least substantially transverse to the first elongated opening, wherein each of the first series of repeated slots is spaced apart from an adjacent slot in the first series of repeated slots along the first elongated opening.

Antenna and/or waveguide assemblies for vehicles, such as RADAR sensor antenna assemblies, along with associated signal confinement structures. In some embodiments, the assembly may comprise an antenna block defining one or more waveguides. A conductive layer may be coupled to the antenna block to form, at least in part, a wall of the waveguide. The assembly may comprise one or more periodic structures that may be operably coupled to the waveguide, each of which may comprise a first elongated opening and a first series of repeated slots extending at least substantially transverse to the first elongated opening, wherein each of the first series of repeated slots is spaced apart from an adjacent slot in the first series of repeated slots along the first elongated opening.

A high-frequency module includes: a chassis which is made of a conductor and which has an internal space; a high-frequency circuit board which is housed in the internal space of the chassis; and a resistive element provided between an inner wall that opposes the high-frequency circuit board among inner walls of the chassis which define the internal space and the high-frequency circuit board.

A packaging structure, a method of manufacturing a packaging structure, and a quantum processor include a substrate; a coplanar waveguide including a first ground wire, a second ground wire, and a signal wire, wherein the first ground wire, the second ground wire, and the signal wire are disposed on a surface of the substrate at intervals, and the signal wire is located between the first ground wire and the second ground wire; an air bridge including a first end connected with the first ground wire and a second end connected with the second ground wire, wherein a gap exists between the air bridge and a surface of the signal wire away from the substrate; and a compensation structure located on the surface of the substrate.

A directional coupler includes a main line, a sub line electromagnetically coupled to the main line, a coupling output terminal connected to one end of the sub line, a filter connected between the one end of the sub line and the coupling output terminal, and a filter with a pass band higher than a pass band of the filter. One end of the filter is connected to the coupling output terminal. Another end of the filter is terminated.

A method and system for beam deflection. The method and system for beam deflection comprises a compact superconducting RF cavity further comprising a waveguide comprising an open ended resonator volume configured to operate as a trapped dipole mode; a plurality of cells configured to provide a high operating gradient; at least two pairs of protrusions configured for lowering surface electric and magnetic fields; and a main power coupler positioned to optimize necessary coupling for an operating mode and damping lower dipole modes simultaneously.

An RF power combiner functioning as a higher-order harmonics filter comprises: at least one pair of coaxially arranged disc-shaped metal conductors, at least one of the conductors having a central axial opening to accommodate a waveguide is provided. Facing surfaces of the disk-shaped metal conductors are shaped symmetrically with respect to the plane of symmetry of the disk-shaped metal conductors to form a plurality of consecutive, radially communicating concentric cavities having isosceles trapezoids with different bases in section. The smaller base of each trapezoid disposed closer to the central axis. The number of the concentric cavities is (2 k+1), where K is the number of signal harmonics being filtered.