A dielectric waveguide filter includes first resonant cavities, which are connected to form upper resonant cavities, and second resonant cavities, which are connected to form lower resonant cavities, wherein the upper and lower resonant cavities are correspondingly overlapped; each of the first resonant cavities has a first window coupling structure, wherein the first window coupling structure includes a first window opened at a position where the magnetic field distribution of a high-order mode in each of the first resonant cavities is the weakest, and/or a second window opened at a position where the electric field distribution of the high-order mode in each of the first resonant cavities is the strongest; and each of the second resonant cavities has a second window coupling structure corresponding to the first window coupling structure, and the first and second window coupling structures cooperate to eliminate the high-order modes of the dielectric waveguide filter.

The current invention describes a method of manufacturing a porous dielectric material, the method comprising (a) providing a porous template, (b) coating the porous template with an inorganic dielectric material or a precursor of an inorganic dielectric material to form a coated porous template, (c) treating the coated porous template to remove the porous template and to form a porous structure of dielectric material from the coating of inorganic dielectric material or precursor of an inorganic dielectric material, and (d) combining the formed porous structure of dielectric material with a coating polymer to form the porous dielectric material. The invention also relates to RF components on a substrate material, with a conductive material deposited on a porous dielectric material.

Embodiments of this application disclose a dielectric filter and a communication device. In one example, the dielectric filter includes: a first dielectric block and a second dielectric block that are stacked up, where a first surface of the first dielectric block is opposite to a second surface of the second dielectric block; a first blind hole, a first through hole, and two or more resonance through holes whose openings are located on the first surface of the first dielectric block, and a second through hole whose opening is located on the second surface of the second dielectric block. A metal layer on the first surface of the first dielectric block is connected to a metal layer on the second surface of the second dielectric block.

Embodiments disclosed herein include package substrates with filter architectures. In an embodiment, a package substrate comprises a core with a first surface and a second surface, and a filter embedded in the core. In an embodiment, the filter comprises a ground plane, where the ground plane is substantially orthogonal to the first surface of the core, and a resonator adjacent to the ground plane.

Apparatuses, methods, and systems for a housing structure for maintaining alignment between ceramic sections of a bandpass filter are disclosed. One housing structure includes an L-shaped outer structure, a plurality of flexure portions, wherein at least one of flexure portion extends from an end portion of each of extended arms of the L-shaped outer structure, wherein each flexure portion extends inward perpendicular to each of the extended end portion, and a plurality of reference datums, wherein at least one reference datum is located between an L-joint of the L-shaped outer structure, and a one of the flexure portions. The housing structure operates to receive a plurality of sections of a waveguide filter, wherein each section includes a plurality of planar surfaces, wherein the datums and the flexure portions are operative to maintain alignment of the sections of the waveguide filter relative to each other.

The present invention relates to a cavity filter and, in particular, provides an advantage of preventing performance deterioration of an antenna device by efficiently absorbing an assembly tolerance which may occur due to assembly design and preventing an interruption of an electrical flow, by comprising: an RF signal connecting part provided to be spaced apart at a predetermined distance from an external member having an electrode pad formed on one surface thereof; a terminal part which electrically connects the electrode pad of the external member to the RF signal connecting part, while absorbing an assembly tolerance existing within the predetermined distance and simultaneously preventing an interruption of an electrical flow between the electrode pad and the RF signal connecting part; a dielectric body which is inserted into a terminal insertion hole so as to surround the outside of the terminal part; and an elastic member which has a portion of the edge supported by the dielectric body and which elastically supports the terminal part by means of an operation in which a hollow part is deformed in the vertical direction when an assembly force is transmitted to the terminal part supported to pass through the hollow part, wherein the terminal part comprises one terminal brought into contact with the electrode pad and the other terminal connected to the RF signal connecting part.

A multi-mode transmission line includes a first and second conductive layers, first and second waveguide walls, a strip line, and a blind conductor. The second conductive layer that is formed over the first conductive layer. The first waveguide wall is elongated in a first direction and is in contact with the first conductive layer and the second conductive layer in a vertical direction. The second waveguide wall is elongated in the first direction parallel to the first waveguide wall and is in contact with the first conductive layer and the second conductive layer in the vertical direction. The strip line is formed between the first and second conductive layers and between the first and second waveguide walls. The blind conductor is connected to one of the first conductive layer, the second conductive layer, the first waveguide wall, or the second waveguide wall.

This application provides an example dielectric filter and an example communications device. The dielectric filter includes a dielectric block. At least two resonant through holes that are parallel to each other are provided in the dielectric block. The resonant through hole is a stepped hole. The stepped hole includes a large stepped hole and a small stepped hole that are arranged coaxially and that are in communication. The small stepped hole passes through a first surface of the dielectric block. The large stepped hole passes through a second surface of the dielectric block. A stepped surface is formed between the large stepped hole and the small stepped hole. The surfaces of the dielectric block are covered with conductor layers. The conductor layers cover the surfaces of the dielectric block and inner walls of the large stepped hole and the small stepped hole. A conductor layer of the inner wall of the large stepped hole is short-circuited with a conductor layer of the second surface. A conductor layer of the inner wall of the small stepped hole is short-circuited with a conductor layer of the first surface. A loop gap that does not cover the conductor layers is provided on the stepped surface. The loop gap is arranged around the small stepped hole.

A dielectric waveguide filter comprising a block of dielectric material including exterior surfaces covered with a layer of conductive material. A plurality of resonators are formed on the block. RF signal input/outputs are formed on the block. An RF signal is transmitted through the block in a serpentine pattern. In one embodiment, a RF signal transmission channel is formed in the block and extends between and surrounding selected ones of the plurality of resonators in a serpentine pattern. In one embodiment, selected ones of the plurality of resonators are comprised of respective islands of dielectric material formed on one of the top and bottom surfaces of the block of dielectric material surrounded by the channel and respective counter-bores formed and extending into the respective islands of dielectric material. In another embodiment, the respective islands of dielectric material and counter-bores defining the respective resonators are formed in opposed top and bottom surfaces of the block.

A composite electronic device comprises a ceramic waveguide, CWG, device having at least two input/output, I/O, ports; and a ceramic stripline, CS, device comprising at least one stripline transmission paths having at least two I/O ports. The CS device is affixed to the CWG device such that at least one of the I/O ports of the CWG device is electrically connected to a corresponding one I/O port of the CS device.