The present disclosure relates to a kinetic inductance parametric amplifier that comprises an input port arranged to receive a pump tone, a DC bias and input signal; an output port arranged to provide an amplified version of the input signal; a tunable stepped-impedance assembly arranged to attenuate and/or filter predetermined frequency bands; and a high kinetic inductance line. The tunable stepped-impedance assembly is tuned at a frequency that allows for the amplifier to resonate at a predetermined frequency and a pump tone with a frequency higher than the input signal and a DC biasing signal to be transmitted to the high kinetic inductance line.

Disclosed herein are printed circuit boards (PCBs) with patterned ground structure filters and data storage devices comprising such PCBs. Each PCB comprises a resonator having an L-shape or a zig-zag shape in a plane of the printed circuit board and at least one signal trace. The resonator has a first dimension and a second dimension in the plane of the printed circuit board. A portion of the at least one signal trace is situated over the resonator and is separated by a distance from the resonator by a dielectric material. In some embodiments, at least part of the portion of the at least one signal trace extends in a same direction as the first dimension (in the case of an L-shaped resonator) or tracks the zig-zag shape of the resonator (in the case of a zig-zag-shaped resonator).

A high-frequency transmission device includes first and second resonators as ring-shaped wires each having an opening part at a part thereof, first and second input/output terminals each electrically connected to both resonators, a first ground shield formed on a plane different from planes on which both resonators are arranged, a second ground shield formed on a plane different from the planes on which both resonators and the first ground shield are arranged, and first and second ground wires each formed to surround peripheries of both resonators. The ground shields and the ground wires are respectively connected to each other. A dielectric wire is present between both ground wires, and the ground wires are not electrically connected to each other.

Device and a method of forming an integrated circuit (IC) that offers protection against ESD in RE applications is disclosed. The device includes a transmission line (TL) coupled to a signal pad. The TL is a short circuited stub that is configured as an ESD protection device and as a band pass filter in dependence of a center frequency of the band pass filter. The TL is configured to pass through a signal in response to a frequency of the signal being within an allowable range of frequencies of the band pass filter. The TL functioning as an ESD protection device is configured to shunt the signal in response to the frequency being outside the allowable range. The IC may include an array of control switches that are operable to change an electrical length L of the TL. The center frequency is tunable by controlling the electrical length L.

A system and method for vertically integrating heterogeneous devices into a 3D tile architecture are disclosed. The system uses high precision microelectronics fabrication techniques and known-good-die to achieve high yield to integrate devices to process radio frequency signals at microwave frequencies of approximately 300 MHz to 300 GHz and above. The inventive architecture is based on a high density of small diameter vias to manage the integrity of electrical interconnects and simplify electrical routing.

An electrical filter structure for forwarding an electrical signal from a first port, e.g. P1, to a second port, e.g. P2, in a frequency selective manner, wherein the filter is a microwave filter, the electrical filter structure comprising: a plurality of pairs of an open stub and a short-circuited stub coupled electrically in parallel to a transmission line comprising a plurality of transmission line portions at a plurality of respective junctions between adjacent transmission line portions, e.g. Cross junction; and wherein the first port is connected with a first of the junctions having a first pair comprising a first open stub and a first short-circuited stub; wherein the second port is connected with a last of the junctions having a last pair comprising a last open stub and a last short-circuited stub; wherein lengths of the pair of the open stub and the short-circuited stub coupled to a same of the junctions are chosen such that electrical lengths of the open stub and short-circuited stub of the respective pairs are equal within a tolerance of +/−10%.

A transmission line for transmitting radiofrequency range current between a first conductive element and a second conductive element, the transmission line comprising a signal current line and at least one return current line, the signal current line and the return current line(s) extending in parallel. Each current line comprises at least one first segment and at least one second segment. Each first segment is partially aligned with at least one adjacent second segment, aligned segments being separated by a first dielectric gap, and each aligned first segment and second segment forming a capacitive coupling across the first dielectric gap. This solution enables a transmission line which provides only small capacitive loading onto its surroundings, and which therefore can extend, e.g., through an antenna element without significantly affecting the performance of the antenna element.

In a general aspect, a microwave quantum circuit includes an on-chip impedance matching circuit. In some cases, a microwave quantum circuit includes a dielectric substrate, a quantum circuit device on the substrate, and an impedance matching circuit device on the substrate. The quantum circuit device includes a Josephson junction, and the impedance matching circuit device is coupled to the quantum circuit device on the substrate.

A filter is provided, and the filter includes two mutually coupled slow-wave resonators. Each resonator includes a coplanar waveguide (CPW) transmission line, a tapered CPW transmission line, and a ground stub, and can generate a slow-wave feature to push a high-order harmonic wave of a baseband signal to a high frequency, so as to implement a wide stopband feature. In addition, a slow-wave effect is used to properly design a size of a filter, to reduce an entire area of the filter and reduce costs. Moreover, two resonators are coupled, to enhance passband performance of the filter, increase bandwidth, increase in-passband flatness, and reduce an insertion loss.

The present disclosure relates to a kinetic inductance parametric amplifier that comprises an input port arranged to receive a pump tone, a DC bias and input signal; an output port arranged to provide an amplified version of the input signal; a tunable stepped-impedance assembly arranged to attenuate and/or filter predetermined frequency bands; and a high kinetic inductance line. The tunable stepped-impedance assembly is tuned at a frequency that allows for the amplifier to resonate at a predetermined frequency and a pump tone with a frequency higher than the input signal and a DC biasing signal to be transmitted to the high kinetic inductance line.