A plane filter includes a dielectric substrate, a filter part provided on the dielectric substrate, and an input/output line connected to the filter part on the dielectric substrate. The filter part and the input/output line are provided on a front surface of the dielectric substrate. The dielectric substrate includes first and second regions. The filter part is provided in the first region, and the input/output line is provided in the second region. The first region having a first thickness in a first direction toward the front surface from a back surface at a side opposite to the front surface. The second region having a second thickness in the first direction, the second thickness being less than the first thickness. The back surface includes a step corresponding to a difference between the first thickness and the second thickness.

A plane filter includes a dielectric substrate, a filter part provided on the dielectric substrate, and an input/output line connected to the filter part on the dielectric substrate. The filter part and the input/output line are provided on a front surface of the dielectric substrate. The dielectric substrate includes first and second regions. The filter part is provided in the first region, and the input/output line is provided in the second region. The first region having a first thickness in a first direction toward the front surface from a back surface at a side opposite to the front surface. The second region having a second thickness in the first direction, the second thickness being less than the first thickness. The back surface includes a step corresponding to a difference between the first thickness and the second thickness.

A multi-channel filter with a PCB with a first side with signalling tracks and shielding tracks between neighbouring signalling tracks. On the second side, a conductive layer is provided. The signalling tracks are covered by an electromagnetically absorbing material, such as a powder of an electrically conducting material is provided. The filter may have sections with reversed structure where the conductors are on the second side and the layer on the first side, where the conductors on opposite sides are interconnected. The filter may be rolled or folded.

A multi-channel filter with a PCB with a first side with signalling tracks and shielding tracks between neighbouring signalling tracks. On the second side, a conductive layer is provided. The signalling tracks are covered by an electromagnetically absorbing material, such as a powder of an electrically conducting material is provided. The filter may have sections with reversed structure where the conductors are on the second side and the layer on the first side, where the conductors on opposite sides are interconnected. The filter may be rolled or folded.

Methods and apparatus for a frequency selective limiter (FSL) having a magnetic material substrate that tapers in thickness and supports a transmission line that has segments and bends. The segments, which differ in width and are substantially parallel to each other, such that each segment traverses the substrate on a constant thickness of the substrate.

A method of constructing an RF filter comprises designing an RF filter that includes a plurality of resonant elements disposed, a plurality of non-resonant elements coupling the resonant elements together to form a stop band having a plurality of transmission zeroes corresponding to respective frequencies of the resonant elements, and a sub-band between the transmission zeroes. The non-resonant elements comprise a variable non-resonant element for selectively introducing a reflection zero within the stop band to create a pass band in the sub-band. The method further comprises changing the order in which the resonant elements are disposed along the signal transmission path to create a plurality of filter solutions, computing a performance parameter for each of the filter solutions, comparing the performance parameters to each other, selecting one of the filter solutions based on the comparison of the computed performance parameters, and constructing the RF filter using the selected filter solution.

A superconducting circuit may include a transmission line having at least one transmission line inductance, a superconducting resonator, and a coupling capacitance that communicatively couples the superconducting resonator to the transmission line. The transmission line inductance may have a value selected to at least partially compensate for a variation in a characteristic impedance of the transmission line, the variation caused at least in part by the coupling capacitance. The coupling capacitance may be distributed along the length of the transmission line. A superconducting circuit may include a transmission line having at least one transmission line capacitance, a superconducting resonator, and a coupling inductance that communicatively couples the superconducting resonator to the transmission line. The transmission line capacitance may be selected to at least partially compensate for a variation in coupling strength between the superconducting resonator and the transmission line.

The present invention relates to an RF filter assembly for an antenna. Particularly, the RF filter assembly for an antenna comprises: a main board on which a plurality of electronic components are mounted; a plurality of RF filters which are installed on one surface of the main board; and a filter support member which is disposed between the main board and the plurality of RF filters, is made of a metal material, and separates each of the plurality of RF filters in the direction of the one surface of the main board. Thereby, the present invention provides advantages of preventing the occurrence of cracks in solder cream caused by differences in thermal expansion coefficients between the main board and each RF filter, and also, enabling a more precise RF filter arrangement, and improving product reliability.

A composite electronic component includes a multilayered body in which a plurality of dielectric layers and a plurality of conductor layers are alternately stacked, a first resonant circuit including a first line and a first capacitor, the first line being formed of one or more first conductor layers of the conductor layers, the first capacitor including a first electrode formed of a plurality of second conductor layers of the conductor layers, and a second resonant circuit including a second line and a second capacitor, the second line being formed of one or more third conductor layers of the conductor layers, the second capacitor including a second electrode formed of the second conductor layers, the second conductor layers being located between the one or more first conductor layers and the one or more third conductor layers.

A semiconductor technology implemented high-frequency channelized filter includes a dielectric substrate with metal traces disposed on one of two major surfaces of the substrate. An input and output port disposed on the substrate and one of the metal traces carrying a high-frequency signal to be filtered between the input and output port. Other of the metal traces are connected to the one metal trace at intervals along the length of the one metal trace each providing a reactance to the high-frequency signal where the reactance varies with frequency and additional traces of the metal traces serving as a reference ground for the one metal trace and the other metal traces. A silicon enclosure mounted to the substrate with a first planar surface with cavities in the enclosure that extend through the first surface, and internal walls within the silicon enclosure defining the cavities. A layer of conductive metal covers the first planar surface, cavities and the internal walls. The silicon enclosure having substantially continuous areas of metal on the first planar surface about the periphery of the silicon enclosure that engage corresponding areas of the additional traces about the periphery of the substrate. The cavities surround the respective other metal traces with the internal cavity walls engaging the additional traces adjacent the respective other metal traces to individually surround each of the other metal traces with a conductive metal thereby providing electromagnetic field isolation between each of the other metal traces.