An electronic device includes a circuit board and an electric element mounted on the circuit board. The electric element includes a multilayer body made of electrically insulating base materials, a transmission line portion, and connection portions. The transmission line portion and the connection portions are provided in the multilayer body. Each of the connection portions is continuous with a corresponding portion of the transmission line portion, and is connected to the circuit board by an electrically conductive bonding material. The transmission line portion other than the connection portions is not electrically connected to an electronic component on the circuit board. The electronic component not electrically connected to the electric element is disposed between the transmission line portion of the electric element and the circuit board.

A base station antenna, including power dividers, network calibration modules, and connectors. The base station antenna includes at least two phase shifters. At least one phase shifter is integrated with a combiner, the connectors are connected to the network calibration modules, and the network calibration modules are connected to the phase shifters. The one phase shifter integrated with the combiner is connected to the power divider, and at least one output port of the at least one other phase shifter is connected to the phase shifter integrated with the combiner. The base station antenna has an integrated design of phase shifters and combiners.

An exemplary semiconductor technology implemented microwave filter includes a dielectric substrate with metal traces on one surface that function as frequency selective circuits and reference ground. A top enclosure encloses the substrate have respective interior recesses with deposited continuous metal coatings. A plurality of metal bonding bumps or bonding wall extends outwardly from the projecting walls of the bottom and top enclosures. The bonding bumps on the top enclosure engage reference ground metal traces on respective surface of the substrate. As a result of applied pressure, the bonding bumps and respective reference ground metal traces together with the through-substrate vias form a metal-to-metal singly-connected ground reference structure for the entire circuitry.

A composite electronic device comprises a ceramic waveguide, CWG, device having at least two input/output, I/O, ports; and a ceramic stripline, CS, device comprising at least one stripline transmission paths having at least two I/O ports. The CS device is affixed to the CWG device such that at least one of the I/O ports of the CWG device is electrically connected to a corresponding one I/O port of the CS device.

An exemplary semiconductor technology implemented microwave filter includes a dielectric substrate with metal traces on one surface that function as frequency selective circuits and reference ground. Other metal traces on the other surface of the substrate also provide reference ground. Bottom and top enclosures that enclose the substrate have respective interior recesses with deposited continuous metal coatings. A plurality of metal bonding bumps or bonding wall extends outwardly from the projecting walls of the bottom and top enclosures. The bonding bumps on the bottom and top enclosures engage reference ground metal traces on respective surfaces of the substrate. As a result of applied pressure, the bonding bumps and respective reference ground metal traces together with the through-substrate vias form a metal-to-metal singly-connected ground reference structure for the entire circuitry.

A coupler includes: a first layer including a first conductive flat plate; a second layer including a signal transmission line electrically connected to the first conductive flat plate, the second layer including a first line port configured to input a signal output from a wireless communication circuit, and a second line port electrically connected to an antenna; a third layer electrically connected to the first conductive flat plate and including a first conductive pattern electrically connected to the signal transmission line; and a capacitor electrically connected to the first conductive flat plate.

Various substrate-integrated waveguide (SIW) filtering crossover systems are described. An example SIW filtering crossover system may include: a substrate; a top metal plate placed on top of the substrate; a bottom metal plate placed beneath the substrate; a plurality of metalized via-holes in the substrate connecting the top metal plate and the bottom metal plate; and a plurality of grounded-coplanar-waveguides (GCPWs) coupled to sidewalls of the crossover system, wherein each of the GCPWs connects the crossover system to a respective microstrip line for signal transmission between the respective microstrip line and the crossover system.

The present disclosure provides circuits and methods for fabricating circuits. A circuit may include an insulator having a first surface, a second surface, a periphery, a first subset of circuit elements disposed on the first surface, a second subset of circuit elements disposed on the second surface, and at least one conductive sidewall disposed on the periphery, wherein the conductive sidewall electrically couples the first subset of circuit elements to the second subset of circuit elements.

The first member and the second member include, when a line that connects a first port and a second port is denoted by a reference line, a first groove that has a central point on the reference line and extends in a direction that intersects with the reference line; a second groove that connects one end of the first groove and the first port; a third groove that connects the other end of the first groove and the first port and has a shape that is line symmetrical to the second groove with respect to the reference line; a fourth groove that connects the other end (FN2) of the first groove and the second port; and a fifth groove that connects one end (FN1) of the first groove and the second port and has a shape that is line symmetrical to the fourth groove with respect to the reference line.

Embodiments of the present invention disclose a microstrip multiplexer, including a feeder, multiple microstrip filters, and a signal processing network. The multiple microstrip filters are separately connected to the signal processing network, and the signal processing network is connected to the feeder. Output signals of the microstrip filters of the multiple microstrip filters are combined by using the signal processing network and then output by using the feeder and/or a signal input from the feeder is split by using the signal processing network and then output to the microstrip filters. In the embodiments of the present invention, a wideband multiplexer that combines multiple wide subband signals for using can be implemented, and each subband has good frequency band response.