The present invention relates to a cavity filter and a connecting structure included therein. The cavity filter includes: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein the terminal portion includes: a first side terminal contacted with the electrode pad; and a second side terminal having a housing space in which a part of the first side terminal is housed, and connected to the RF signal connecting portion, wherein the first side terminal is provided as an elastic deformable body whose part is radially widened or narrowed against an assembly force provided by an assembler. Therefore, the cavity filter can efficiently absorb assembly tolerance which occurs through assembly design, and prevent disconnection of an electric flow, thereby preventing degradation in performance of an antenna device.

Proposed is a radio frequency (RF) multiplexer of a 5G mmWave low-loss broadband wireless hybrid type using a waveguide cavity Ka-band in which outputs of a mobile communication band communication system using a plurality of satellite frequencies are combined, thereby reducing an insertion loss and increasing passive inter-modulation distortion (PIMD) performance, and signals at adjacent frequencies in a 5G mobile communication band are effectively filtered using a single mode or multiple modes, thereby reducing a size of a filter to reduce a weight thereof. The RF multiplexer of the 5G mmWave low-loss broadband wireless hybrid type using the waveguide cavity Ka-band includes bandpass filters which may receive signals in an RF frequency band to perform tuning and a coupler which combines outputs of at least two bandpass filters to match an antenna.

A combined isolator-diplexer device for supplying radiofrequency (RF) energy and microwave energy obtained from separate sources to a probe via a common signal pathway. The invention combines into a single unit all the necessary components to isolate a microwave channel from an RF channel whilst providing a high withstanding voltage (e.g. greater than 10 kV). The device comprises a waveguide isolator for isolating the microwave channel having a pair of DC isolation barriers arranged therein to provide a pair of series-connected capacitive structures between a ground conductor at an output of the combining circuit and a conductive input section of the waveguide isolator.

The present invention relates to a cavity filter and a connecting structure included therein. The cavity filter includes: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein the terminal portion includes: a first side terminal contacted with the electrode pad; and a second side terminal having a housing space in which a part of the first side terminal is housed, and connected to the RF signal connecting portion, wherein the first side terminal is provided as an elastic deformable body whose part is radially widened or narrowed against an assembly force provided by an assembler. Therefore, the cavity filter can efficiently absorb assembly tolerance which occurs through assembly design, and prevent disconnection of an electric flow, thereby preventing degradation in performance of an antenna device.

A passive device comprising a hollow waveguide including first and second wall structures extending in a guiding direction, an interconnecting base extending between the wall structures and an enclosure extending between the wall structures, the enclosure being located opposite the interconnecting base; and at least one array of coupled resonant structures enclosed inside the waveguide, the array being configured to provide coupled local resonators and a microwave or millimeter wave frequency passband for providing at least one selected microwave or millimeter wave signal, the array extending along the guiding direction and being located between the wall structures. Each resonant structure extends from the interconnecting base into the hollow waveguide to define a microwave or millimeter wave subwavelength resonant structure, and successive resonant structures are separated by a microwave or millimeter wave subwavelength distance. A resonance frequency of the resonant structures is less than a cut-off frequency of the waveguide.

A wireless transmission system comprising a main circuit board having a first controller and a first connector assembly associated therewith; a removable and replaceable radio frequency module for transmitting and receiving wireless data, wherein the radio frequency module includes a second controller, a first module connector assembly, and a second connector assembly that is configured to couple to the first connector assembly; a removable and replaceable diplexer module for sending and receiving the wireless data at different frequencies, wherein the diplexer module includes a storage element, a first waveguide port connector, and a second module connector assembly that is configured to couple to the first module connector assembly; and a transition waveguide module having a second waveguide port connector that is configured to couple to the first waveguide port connector.

Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.

The disclosed radio frequency (RF) bandpass filter may include an RF transmission medium that defines (1) a plurality of cavities aligned parallel to each other along a major axis, where (a) each cavity includes planar surfaces that define (i) a first dimension aligned with the major axis and (ii) second and third dimensions aligned perpendicular to the major axis and each other, where the first dimension is shorter than the second and third dimensions and (b) each adjacent pair of cavities is coupled by an inter-cavity slot, (2) an RF inlet that couples a received RF signal to a first cavity at a first end of the plurality of cavities, and (3) an RF outlet that couples a filtered RF signal from a second cavity at a second end of the plurality of cavities externally to the filter. Various other filters and manufacturing methods thereof are also disclosed.

An antenna array includes at least two antennas with dual polarization, each antenna including: at least one first port intended for a first signal with a first polarization; at least one second port intended for a second signal with a second polarization; a polarizer including a septum for combining the signal on the first port with the signal on the second port; a polarization-preserving evanescent filter, one end of which is directly coupled to the polarizer and the other end is directly coupled to the ether. The evanescent filter includes an internal channel with at least one internal face provided with protuberances to match the impedance of the antenna to that of the ether.

Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.