Hollow waveguide termination device utilizing a housing and a cup shaped inner attenuation element arranged therein and made of a material which absorbs electromagnetic oscillations. The attenuation element has a tubular section and a front wall section closing the tubular section on one side.

A tunable power absorbing termination for a waveguide transmission line includes a section of waveguide having a front power feed end, a back power extracting end, and guidewalls extending between the front and back end thereof. A coolant circulating dielectric taper extends into the section of waveguide in an inclined orientation relative to a guidewall of the section of waveguide such that the point end of the taper extends substantially to the front power feed end of the waveguide section. The inclined orientation of the dielectric taper creates a free volume of space adjacent the taper behind the front power feed end of the waveguide section into which a tuner element is introduced which is position adjustable within the free volume of space to provide the power absorbing termination with a tuning capability.

A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.

A microwave heating device includes a variable frequency microwave power supply, a waveguide launcher, and a fixture to contain a material to be heated, with the fixture located directly adjacent to the end of the launcher. All heating occurs in the near-field region. This condition may be insured by keeping the thickness of the fixture or workpiece under one wavelength (at all microwave frequencies being used). The launcher is preferably a horn or waveguide configured to apply the microwave power to a small area to perform spot curing or repair operations involving adhesives and composites. The spot curing may secure components in place for further handling, after which a thermal or oven treatment will cure the remaining adhesive to develop adequate strength for service.

A power sensor system, assembly and method for use as a power sensor standard in the 50 to 75 GHz frequency range. The power sensing system comprises a housing comprising a dual ridged waveguide impedance transformer, and a resistive component attachable to a back side of the housing. The resistive component comprises a terminating element electrically, but not thermally isolated from a sensing element. The sensing element operates at a constant resistance and is perpendicularly oriented to the terminating element.

A microwave heating device includes a variable frequency microwave power supply, a waveguide launcher, and a fixture to contain a material to be heated, with the fixture located directly adjacent to the end of the launcher. All heating occurs in the near-field region. This condition may be insured by keeping the thickness of the fixture or workpiece under one wavelength (at all microwave frequencies being used). The launcher is preferably a horn or waveguide configured to apply the microwave power to a small area to perform spot curing or repair operations involving adhesives and composites. The spot curing may secure components in place for further handling, after which a thermal or oven treatment will cure the remaining adhesive to develop adequate strength for service. A related method is also disclosed.

A coaxial power sensor assembly configured to provide a broadband matched termination utilizing coplanar waveguide topology while simultaneously providing a source of heat energy for a surface mount chip thermistor element to measure applied input power. The coaxial thermal power sensor is comprised of a thin film resistive device on a dielectric substrate and a surface mount chip thermistor element placed in close planar proximity to the resistive device in order to maximize the heat flux via a closely coupled thermal path to the thermistor and alter the bias current through the resistance to be measured. The power sensor is intended to function from DC to 70 GHz, but the same should not be construed as a limitation.

Aspects of the subject disclosure may include, a system that facilitates receiving a radio frequency signal conveying data, magnetically coupling the radio frequency signal to a transmission medium as an electromagnetic wave that propagates along the transmission medium, and directing propagation of the electromagnetic wave in a first direction along the transmission medium and preventing at least in part propagation of the electromagnetic wave in a second direction opposite the first direction. Other embodiments are disclosed.

A waveguide rotary joint includes a first waveguide member comprising a first waveguide portion, and a second waveguide member comprising a second waveguide portion, the second waveguide member rotatably connected via a curved circumferential path to the first waveguide member, wherein the second waveguide portion is adjacent to the first waveguide portion to define a first split rectangular waveguide. A first waveguide input/output port is communicatively coupled to the first waveguide portion, and a second waveguide input/output port is communicatively coupled to the second waveguide portion. Relative rotation between the first waveguide member and the second waveguide member changes an angular length of the first waveguide connecting the first waveguide input/output port to the second waveguide input/output port.

A waveguide unit (2) is closed at one end thereof by a short circuit plane (2a) provided with through holes (3-1 to 3-6). Radio wave absorbers (4-1 to 4-6) absorb a frequency signal being a non-reflective target in the state of being inserted through the through holes (3-1 to 3-6) toward the inside of the waveguide unit (2) and contacting inner surfaces (3-1 to 3-6) of the through holes (3-1 to 3-6).