According to an embodiment, an antenna includes a conductive antenna element, a voltage-bias conductor, and a polarization-compensation conductor. The conductive antenna element is configured to radiate a first signal having a first polarization, and the voltage-bias conductor is coupled to a side of the antenna element and is configured to radiate a second signal having a second polarization that is different from the first polarization. And the polarization-compensating conductor is coupled to an opposite side of the antenna element and is configured to radiate third a signal having a third polarization that is approximately the same as the second polarization and that destructively interferes with the second signal. Such an antenna can be configured to reduce cross-polarization of the signals that its antenna elements radiate.

A microwave heating device includes a variable frequency microwave power supply, a waveguide launcher, and a fixture to contain a material to be heated, with the fixture located directly adjacent to the end of the launcher. All heating occurs in the near-field region. This condition may be insured by keeping the thickness of the fixture or workpiece under one wavelength (at all microwave frequencies being used). The launcher is preferably a horn or waveguide configured to apply the microwave power to a small area to perform spot curing or repair operations involving adhesives and composites. The spot curing may secure components in place for further handling, after which a thermal or oven treatment will cure the remaining adhesive to develop adequate strength for service. A related method is also disclosed.

A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.

A meta-surface water load includes a waveguide section, a water load section and two meta-surface plates; the water load section is arranged at a rear end of the waveguide section; the two meta-surface plates are arranged opposite on inner walls of two narrow sides of the waveguide section; the water load section includes a metal casing, a ceramic partition, a water inlet and a water outlet; the metal casing is mounted at the rear end of the waveguide section; cooling liquid flows in the metal casing, entering from the water inlet and leaving from the water outlet; the ceramic partition is for separating interior of the waveguide section and interior of the metal casing; a relative permittivity of materials from front to rear of each meta-surface plate is progressively increased, so that microwave in the waveguide section is propagated to the water load section in one direction.

A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.

A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.

A tunable power absorbing termination for a waveguide transmission line includes a section of waveguide having a front power feed end, a back power extracting end, and guidewalls extending between the front and back end thereof. A coolant circulating dielectric taper extends into the section of waveguide in an inclined orientation relative to a guidewall of the section of waveguide such that the point end of the taper extends substantially to the front power feed end of the waveguide section. The inclined orientation of the dielectric taper creates a free volume of space adjacent the taper behind the front power feed end of the waveguide section into which a tuner element is introduced which is position adjustable within the free volume of space to provide the power absorbing termination with a tuning capability.

A coaxial power sensor assembly configured to provide a broadband matched termination utilizing coplanar waveguide topology while simultaneously providing a source of heat energy for a surface mount chip thermistor element to measure applied input power. The coaxial thermal power sensor is comprised of a thin film resistive device on a dielectric substrate and a surface mount chip thermistor element placed in close planar proximity to the resistive device in order to maximize the heat flux via a closely coupled thermal path to the thermistor and alter the bias current through the resistance to be measured. The power sensor is intended to function from DC to 70 GHz, but the same should not be construed as a limitation.

A meta-surface water load includes a waveguide section, a water load section and two meta-surface plates; the water load section is arranged at a rear end of the waveguide section; the two meta-surface plates are arranged opposite on inner walls of two narrow sides of the waveguide section; the water load section includes a metal casing, a ceramic partition, a water inlet and a water outlet; the metal casing is mounted at the rear end of the waveguide section; cooling liquid flows in the metal casing, entering from the water inlet and leaving from the water outlet; the ceramic partition is for separating interior of the waveguide section and interior of the metal casing; a relative permittivity of materials from front to rear of each meta-surface plate is progressively increased, so that microwave in the waveguide section is propagated to the water load section in one direction.

A waveguide unit (2) is closed at one end thereof by a short circuit plane (2a) provided with through holes (3-1 to 3-6). Radio wave absorbers (4-1 to 4-6) absorb a frequency signal being a non-reflective target in the state of being inserted through the through holes (3-1 to 3-6) toward the inside of the waveguide unit (2) and contacting inner surfaces (3′-1 to 3′-6) of the through holes (3-1 to 3-6).