An antenna assembly for a transceiver having first antennas arranged on a circuit board, a transmitting and receiving circuit arranged on the circuit board. The first antennas are connected to the transmitting and receiving circuit. Second antennas and terminating resistors are arranged on the circuit board. Each second antenna is connected to one of the terminating resistors by means of a strip line. At least one first contact for measuring HF properties of one of the second antennas and / or at least one second contact for measuring HF properties of the terminating resistor connected to the measurement antenna is arranged on the circuit board. The strip line between the measurement antenna and the terminating resistor is disconnectable at a disconnection point, and the strip line forms, on the side of the disconnection point nearest the measurement antenna, a third contact for measuring the HF properties of the measurement antenna.

A transmission line. The transmission line includes a reference electrode. The transmission line also includes a stripline. The stripline meanders within a plane. The stripline has a non-planar profile when viewed along a direction parallel to the plane.

The present application discloses embodiments that relate to an electromagnetic apparatus. In one aspect, the present apparatus includes a circuit board configured to propagate an electromagnetic signal. The apparatus also includes a waveguide configured to propagate an electromagnetic signal. The apparatus further includes a coupling port configured to couple a signal between the circuit board and the waveguide, where the coupling port has dimensions based on a desired impedance of the port.

A high-frequency terminator includes a dielectric substrate, a metal layer provided on a back surface of the dielectric substrate, a transmission line provided on a front surface of the dielectric substrate, a resistor provided on the front surface of the dielectric substrate and connected to the transmission line, and a conductor electrically connecting the resistor and the metal layer. The dielectric substrate includes a first substrate part having a first thickness in a direction from the back surface toward the front surface, and a second substrate part having a second thickness in the direction that is less than the first thickness. The transmission line extends from the first substrate part to the second substrate part and is connected to the resistor on the second substrate part. The conductor electrically connects the metal layer and the resistor at the second substrate part.

A downhole energy transmission system is described. The system can include a tubing string having a number of tubing pipe disposed within an annulus formed by a casing string disposed within a wellbore, where the tubing string has at least one wall forming a cavity. The system can also include a remote electrical device disposed within the cavity of the tubing string at a first location. The system can further include a first stripline cable disposed on an outer surface of the tubing string, where the first stripline cable transmits a first electromagnetic directional traveling wave received from an energy source. The system can also include a second stripline cable disposed adjacent to the first stripline cable at the first location, where the second stripline cable is electrically coupled to the remote electrical device.

A high frequency termination for converting a high frequency electrical signal of a circuit into heat. The high frequency termination includes a substrate. The high frequency termination also includes a spiral resistor formed on the substrate and having a first end and a second end. The high frequency termination also includes a conductive pad electrically coupled to the first end of the spiral resistor. The high frequency termination also includes a contact electrically coupled to the conductive pad and configured to connect to the circuit.

The present application discloses embodiments that relate to an electromagnetic apparatus. In one aspect, the present apparatus includes a circuit board configured to propagate an electromagnetic signal. The apparatus also includes a waveguide configured to propagate an electromagnetic signal. The apparatus further includes a coupling port configured to couple a signal between the circuit board and the waveguide, where the coupling port has dimensions based on a desired impedance of the port.

Disclosed are various embodiments for a pre-matched power resistance system including a pre-matching network for use with a passive electrical device, such as a Lange coupler or a Wilkinson power splitter, where the system provides a predetermined input impedance across a predetermined target bandwidth. The pre-matched power resistance system network further includes an on-chip thin film resistor disposed on a substrate comprising a plurality of coplanar sub-resistors electrically isolated from one another and a manifold portion comprising a plurality of manifold traces in a tiered arrangement terminating in an electrical connection to a respective one of the coplanar sub-resistors.

Systems and techniques that facilitate high-density embedded broadside-coupled attenuators are provided. In various embodiments, an attenuator can comprise an output line. In various aspects, the attenuator can further comprise a reflectively-terminated input line that is broadside coupled to the output line. In various instances, a downstream end of the reflectively-terminated input line can be shorted to ground. In other instances, a downstream end of the reflectively-terminated input line can be open from ground. In various cases, the output line can exhibit a non-looped-back-layout.

A communication apparatus includes a transmission path arranged on a substrate, a signal source connected to an input portion of the transmission path, a metal member configured to function as a ground portion for the transmission path and having a space between the metal member and the transmission path, and a termination circuit configured to terminate the transmission path, wherein the termination circuit is arranged on a surface of the substrate on which the metal member is arranged.