A quantum device includes a non-reciprocal transmission structure, wherein the transmission structure is designed such that for first waves traversing the transmission structure in a forward direction the phases of the first waves are at least partially conserved, and for second waves traversing the transmission structure in a backward direction, the phases of the second waves are at least partially replaced by random ones, such that the phase conservation is more pronounced in the forward direction than in the backward direction.

A quantum device includes a non-reciprocal transmission structure, wherein the transmission structure is designed such that for first waves traversing the transmission structure in a forward direction the phases of the first waves are at least partially conserved, and for second waves traversing the transmission structure in a backward direction, the phases of the second waves are at least partially replaced by random ones, such that the phase conservation is more pronounced in the forward direction than in the backward direction.

A nonreciprocal microwave transmission device includes a substrate, a transducer on a surface of the substrate and configured to reciprocally convert between electrical signals to acoustic waves, a first piezoelectric material configured to generates and transports acoustic waves from a signal applied to the transducer, and a thin film magnetic material configured to couple to acoustic waves through magnetoelastic coupling so as to have non-reciprocal magnetoelastic coupled acoustic wave transport. Transmission of acoustic waves through the thin film magnetic material is in a direction toward the transducer has a first magnitude and transmission of acoustic waves through the thin film magnetic material in a direction away from the transducer has a second magnitude, the first and second magnitude being significantly different.

A nonreciprocal microwave transmission device includes a substrate, a transducer on a surface of the substrate and configured to reciprocally convert between electrical signals to acoustic waves, a first piezoelectric material configured to generates and transports acoustic waves from a signal applied to the transducer, and a thin film magnetic material configured to couple to acoustic waves through magnetoelastic coupling so as to have non-reciprocal magnetoelastic coupled acoustic wave transport. Transmission of acoustic waves through the thin film magnetic material is in a direction toward the transducer has a first magnitude and transmission of acoustic waves through the thin film magnetic material in a direction away from the transducer has a second magnitude, the first and second magnitude being significantly different.

An integrated circuit is disclosed. The integrated circuit includes a first resonator, a second resonator, and a coupling element. The first resonator has a first terminal and a second terminal, where the first resonator comprises a gain resistor, a gain capacitor, and a gain inductor in parallel and electrically coupling the first terminal with the second terminal. The second resonator has a third terminal and a fourth terminal, where the second resonator includes a loss resistor, a loss capacitor, and a loss inductor in parallel and electrically coupling the third terminal with the fourth terminal. The coupling element selectively couples the first terminal of the first resonator with the third terminal of the second resonator.

An integrated circuit is disclosed. The integrated circuit includes a first resonator, a second resonator, and a coupling element. The first resonator has a first terminal and a second terminal, where the first resonator comprises a gain resistor, a gain capacitor, and a gain inductor in parallel and electrically coupling the first terminal with the second terminal. The second resonator has a third terminal and a fourth terminal, where the second resonator includes a loss resistor, a loss capacitor, and a loss inductor in parallel and electrically coupling the third terminal with the fourth terminal. The coupling element selectively couples the first terminal of the first resonator with the third terminal of the second resonator.

A circulator includes: a ferrite plate; a permanent magnet that applies a direct current (DC) magnetic field to the ferrite plate; a first coil, a second coil, and a third coil arranged on the ferrite plate while being insulated from one another, the first coil, the second coil, and the third coil having coil axes intersecting one another; a first port that is electrically continuous with the first coil; a second port that is electrically continuous with the second coil; and a third port that is electrically continuous with the third coil. An inductance of the first coil or the second coil is different from an inductance of the third coil, and an impedance of the first port or the second port is not 50Ω.

The present invention includes a method for creating a system-in-package in or on photodefinable glass including: providing a photodefinable glass substrate; masking a design layout comprising one or more structures to form one or more integrated lumped element devices as the system-in-package on or in a photodefinable glass substrate; transforming at least a portion of the photodefinable glass substrate to form a glass-crystalline substrate; etching the glass-crystalline substrate to form one or more channels in the glass-crystalline substrate; depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate to enable electroplating of copper; and electroplating the copper to fill the one or more channels and to deposit copper on the surface of the photodefinable glass to form the one or more integrated lumped element devices.

The present invention includes a method for creating a system-in-package in or on photodefinable glass including: providing a photodefinable glass substrate; masking a design layout comprising one or more structures to form one or more integrated lumped element devices as the system-in-package on or in a photodefinable glass substrate; transforming at least a portion of the photodefinable glass substrate to form a glass-crystalline substrate; etching the glass-crystalline substrate to form one or more channels in the glass-crystalline substrate; depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate to enable electroplating of copper; and electroplating the copper to fill the one or more channels and to deposit copper on the surface of the photodefinable glass to form the one or more integrated lumped element devices.

A circuit comprising a differential transmission line and eight switches provides non-reciprocal signal flow. In some embodiments, the circuit can be driven by four local oscillator signals using a boosting circuit. The circuit can be used to form a gyrator. The circuit can be used to form a circulator. The circuit can be used to form three-port circulator than can provide direction signal flow between a transmitter and an antenna and from the antenna to a receiver. The three-port circulator can be used to implement a full duplex transceiver that uses a single antenna for transmitting and receiving.