A component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. The at least one electrically conductive layer structure includes a first trace. A tapering trench is formed in the at least one electrically insulating layer structure beside and below the first trace. A method of manufacturing the component carrier is also described.

A circuit board comprising a circuit board ply, on which are provided a high-frequency component emitting electromagnetic interference waves during operation and at least one other component, especially another high-frequency component, wherein during operation an as low as possible degrading of the other component by interference waves is achieved. There is provided between the high-frequency component and the other component at least one dielectric barrier, which blocks propagation of high-frequency electromagnetic waves between the high-frequency component and the other component.

The present invention discloses a four-mode defected ground structure resonator, comprising a metal dielectric substrate and a defected ground unit which is etched in one surface of the metal dielectric substrate; the shape of the defected ground unit is axially symmetric about a first central axis of the defected ground unit, and also the shape of the defected ground unit is axially symmetric about a second central axis of the defected ground unit; the first defected ground unit is provided with H-shape or quasi H-shape, the second defected ground unit is provided with L-shape, quasi L-shape, U-shape or quasi U-shape. The four-mode defected ground structure resonator of the present invention is provided with four types of resonant modes, and the four types of resonant modes are provided with good tunability.

Embodiments of a circuit, system, and method are disclosed. In an embodiment, a circuit includes first and second microstrip transmission lines. The first and second microstrip transmission lines include linearly arranged conductive strips on the circuit and a slotline formation extends between the first microstrip transmission line and the second microstrip transmission line so that the slotline formation is configured to electromagnetically couple the first microstrip transmission line to the second microstrip transmission line during operation of the circuit. In addition, the circuit includes at least one controllable capacitance circuit electrically connected to at least one of the first microstrip transmission line and the second microstrip transmission line, where a magnitude of a capacitance value of the at least one controllable capacitance circuit (e.g., including a barium strontium titanate (BST) capacitor) is controllable (e.g., in response to a capacitance control signal received at a control interface).

Embodiments of a circuit, system, and method are disclosed. In an embodiment, a circuit includes a first microstrip transmission line, a second microstrip transmission line, and a slotline formation, wherein the slotline formation extends between the first microstrip transmission line and the second microstrip transmission line so that the slotline formation is configured to electromagnetically couple the first microstrip transmission line to the second microstrip transmission line during operation of the circuit. In addition, the circuit includes at least one controllable capacitance circuit electrically connected to at least one of the first microstrip transmission line and the second microstrip transmission line, wherein a magnitude of capacitance of the at least one controllable capacitance circuit is controllable (e.g., in response to a capacitance control signal received at a control interface).

A waveguide low profile slide-screw impedance tuner for seamless on-wafer integration uses rotating metallic tuning probe. This ensures high resolution in the area where the probe penetration is maximum (high GAMMA), a smooth increase of depth (basic anti-electrical discharge—“Corona” form) and compensation for the negative phase trajectory at higher GAMMA, native to traditional vertically moving stub-probes in waveguide tuners. Also, using rotating disc-probes simplifies the tuner mechanics, eliminates the cumbersome precise vertical axis and gear and flattens the tuner profile for best direct connection with wafer-probes.

An antenna having a wedge plate-based waveguide with feed segmentation and a method for using the same are disclosed. In one embodiment, the antenna comprises an aperture having an array of radio-frequency (RF) radiating antenna elements and a segmented wedge plate radial waveguide comprises a plurality of wedge plates that form a plurality of sub-apertures, wherein each sub-aperture includes one wedge plate and a distinct subset of RF radiating antenna elements in the array, wherein each wedge plate of the plurality of wedge plates has a feed point to provide a feed wave for propagation through said each wedge plate for interaction with its distinct subset of RF radiating antenna elements in the array.

An antenna having a wedge plate-based waveguide with feed segmentation and a method for using the same are disclosed. In one embodiment, the antenna comprises an aperture having an array of radio-frequency (RF) radiating antenna elements and a segmented wedge plate radial waveguide comprises a plurality of wedge plates that form a plurality of sub-apertures, wherein each sub-aperture includes one wedge plate and a distinct subset of RF radiating antenna elements in the array, wherein each wedge plate of the plurality of wedge plates has a feed point to provide a feed wave for propagation through said each wedge plate for interaction with its distinct subset of RF radiating antenna elements in the array.

Disclosed is a production process for slotting an outer conductor of a leaky cable, through which an integrated production line incorporating a metal strap slotting production line, a metal strap longitudinal coating production line and a sheathing production line is provided. A semi-finished product from a leaky cable insulation process is subsequently processed by laser in a numerical control laser cutting device for cutting out corresponding slot holes in a metal strap to produce a slotted outer conductor. Then the slotted metal strap is embossed, and directly coated on an insulator in a longitudinal coating forming mould of the outer conductor. The final sheathing process is completed in a sheath plastic extruding machine to produce a finished leaky cable product. The processes of the outer conductor of the leaky cable, including the raw material punching, the longitudinal coating forming, and the outer sheathing, are finished at one time.

Systems and methods for communicating electromagnetic signals and/or power and, more particularly for example, to power combiners and similar systems and methods for communicating electromagnetic signals and/or power generated by amplifiers to loads, are described herein. In at least example embodiment, a power amplifier system includes first and second amplifier circuits and a power combiner circuit coupled to each of the first and second amplifier circuits and having a first microstrip transmission line component, a slotline formation, and an additional coupling component that is capable of being at least indirectly coupled to a load, where the first microstrip transmission line component and additional coupling component are electromagnetically coupled by way of the slotline formation.