A plurality of lead pins (2a-d) penetrates through a stem (1) having a circular shape and includes a signal lead pin (2a,2b). A block (4) is provided on an upper surface of the stem. A waveguide light receiving device (9) is provided on a side surface of the block. An amplifier (6) is provided on the side surface of the block and amplifies an electric signal output from the waveguide light receiving device. A first relay substrate is provided on the upper surface of the stem and arranged between the block and the signal lead pin. A first transmission line (12a,12b) is provided on the first relay substrate. A first wire (10f,10g) connects one end of the first transmission line and an output terminal of the amplifier. A second wire (10h,10i) connects the other end of the first transmission line (12a,12b) and the signal lead pin.

A component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. The at least one electrically conductive layer structure includes a first trace. A tapering trench is formed in the at least one electrically insulating layer structure beside and below the first trace. A method of manufacturing the component carrier is also described.

Embodiments of the present disclosure provide a liquid crystal phase shifter and an antenna, which relate to the field of electromagnetic waves and can adjust carrier frequencies applicable to the liquid crystal phase shifter, improving compatibility of the liquid crystal phase shifter. The liquid crystal phase shifter includes at least one phase-shifting unit. The phase-shifting unit includes a microstrip line and a phase-controlled electrode, the microstrip line includes a plurality of sub-microstrip lines, each sub-microstrip line includes two ends and a transmission portion connected between the two ends, and any two adjacent sub-microstrip lines share one end. The phase-shifting unit further includes feed terminals located on a side of the first substrate facing away from the second substrate or on a side of the second substrate facing away from the first substrate, and each of the feed terminals overlaps the corresponding end respectively.

A transmission line. The transmission line includes a reference electrode. The transmission line also includes a stripline. The stripline meanders within a plane. The stripline has a non-planar profile when viewed along a direction parallel to the plane.

A phase shifter includes a first substrate; a microstrip formed on the first substrate so as to extend in a first direction; a ground layer disposed with a space on the upper surface of the microstrip and having a defected ground structure (DGS) with a defected pattern formed therein; a second substrate disposed on the ground layer; and a liquid crystal layer disposed in a space between the first substrate and the second substrate, wherein DC voltage is applied between the ground layer and the microstrip.

An outphasing amplifier includes a first amplifier configured to amplify a first signal, a second amplifier configured to amplify a second signal of which a phase difference from the first signal changes, and a synthesizer that has a first transmission line through which a third signal output from the first amplifier passes, a second transmission line through which a fourth signal output from the second amplifier passes, a first coupling circuit that is separately provided from the first transmission line and is coupled to the first transmission line, a second coupling circuit that is separately provided from the second transmission line and coupled to the second transmission line, and a node that synthesizes the third signal having passed through the first transmission line and the fourth signal having passed through the second transmission line.

The invention proposes a four-port coupler using micro-strip line in combination with ultra-wide-band compensation circuits. It can be applied for communication systems or information machine systems. The main feature of the invention is the structure and the distribution of the components in the compensation circuit to reduce the size of the coupler. The proposed coupler includes: microstrip directional coupler and compensation circuits, in which the microstrip directional coupler consists of one main line and two secondary transmission lines; the main transmission line has two ports: input and output ports; each secondary is connected to a load and a compensation circuit. The compensation circuit is composed of a low-pass filter and two parallel attenuation regulator circuits.

RF signal transmission devices for a base station antenna include a printed circuit board which has a dielectric layer, a metal pattern layer on a first main surface of the dielectric layer, and a ground layer on a second main surface of the dielectric layer. The metal pattern layer has a transmission line deformation section for enhancing the ability to withstand surge current, and the ground layer comprises a groove that is configured to at least partially compensate for the change in the characteristic impedance due to the transmission line deformation section. The RF signal transmission device can achieve good characteristic impedance matching whilst enhancing the capacity to withstand surge current. In addition, the RF signal transmission device can improve PIM performance. The present disclosure also includes a phase shifter for a base station antenna and a base station antenna.

A printed circuit board of an information handling system includes a dielectric layer, adjacent differential pairs, a ground layer, and a ground wall. The adjacent differential pairs are plated on the dielectric layer, and generate crosstalk between each other. The ground wall is in physical communication with and electrically coupled to the ground layer. The ground wall extends substantially perpendicular from the ground layer through the dielectric layer. A top surface of the ground wall is a specific height above a top surface of the adjacent different pairs. The ground wall suppresses the generated crosstalk based on the specific height and a width of the ground wall.

Disclosed is a semiconductor device including a semiconductor die, a base member, a side wall, first and second conductive films, and first and second conductive leads. The base member has a conductive main surface including a region that mounts the semiconductor die. The side wall surrounds the region and is made of a dielectric. The side wall includes first and second portions. The first and second conductive films are provided on the first and second portions, respectively and are electrically connected to the semiconductor die. The first and second conductive leads are conductively bonded to the first and second conductive films, respectively. At least one of the first and second portions includes a recess on its back surface facing the base member, and the recess defines a gap between the at least one of the first and second portions below the corresponding conductive film and the base member.