An electronic device and a method for manufacturing such an electronic device are described. The electronic device includes an electronic component, and a component carrier in which the electronic component is embedded. The component carrier includes a first component carrier part having a first cut-out portion and a second component carrier part having a second cut-out portion, the first cut-out portion and the second cut-out portion facing opposite main surfaces of the electronic component. An electrically conductive material is provided on the surface of the first cut-out portion and on the surface of the second cut-out portion. The first cut-out portion and the second cut-out portion respectively form a first cavity and a second cavity on opposite sides of the electronic component.

A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view.

The first member and the second member include, when a line that connects a first port and a second port is denoted by a reference line, a first groove that has a central point on the reference line and extends in a direction that intersects with the reference line; a second groove that connects one end of the first groove and the first port; a third groove that connects the other end of the first groove and the first port and has a shape that is line symmetrical to the second groove with respect to the reference line; a fourth groove that connects the other end (FN2) of the first groove and the second port; and a fifth groove that connects one end (FN1) of the first groove and the second port and has a shape that is line symmetrical to the fourth groove with respect to the reference line.

A wiring board (1) includes an insulating substrate (11) having a cutout (12) opened in a main surface and a side surface of the insulating substrate (11), and an inner electrode (13) formed on an inner surface of the cutout (12). The inner electrode (13) includes a plurality of metal layers. The inner electrode (13) includes, as an intermediate layer, at least one metal layer (17b) selected from the group consisting of a nickel layer, a chromium layer, a platinum layer, and a titanium layer, and includes a gold layer as an outermost layer (17a). The metal layer (17b) is exposed at an outer edge portion of the inner electrode (13).

A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view.

In one example an apparatus is provided. The apparatus includes a low frequency radiator, a high frequency radiator, a high frequency waveguide that carries high frequency bands to the high frequency radiator, a low frequency coaxial waveguide coupled to the high frequency waveguide in a coaxial structure, wherein the low frequency coaxial waveguide carries low frequency bands to the low frequency radiator and a low frequency combiner in communication with the low frequency coaxial waveguide, wherein the low frequency combiner comprises a circular low frequency waveguide and air dielectric transmission lines formed by air channels formed above and below a plurality of printed circuits in a metal housing.

A PCB having multiple stacked layers laminated together. The laminated stack includes regular flow prepreg and includes an embedded cavity, the perimeter of which is formed by a photo definable, or photo imageable, polymer structure, such as a solder mask dam. The solder mask dam defines cavity dimensions and prevents prepreg resin flow into the cavity during lamination.

A transmission line includes a first structure including a first flexible resin base material, and a first ground conductor thereon, a second structure including a second flexible resin base material, and a first signal line and an interlayer connection conductor in or on the second resin base material, a first spacer between the first and second structures, and a first metal joining material joining the first and second structures with the first spacer interposed therebetween. A first hollow portion is between the first and second structures with the first spacer interposed therebetween. The first signal line and the first ground conductor face each other in a joining direction with the first hollow portion interposed therebetween. The first resin base material and the second resin base material are not in contact with each other. The first metal joining material has a melting point lower than that of the interlayer connection conductor.

Apparatus and methods are provided for providing provide high-speed traces in inner layers of semiconductor packages or PCBs. In an exemplary embodiment, there is provided an circuit assembly that may comprise a first ground reference plane, a second ground reference plane and a dielectric layer between the first ground reference plane and the second ground reference plane. The dielectric layer may comprise a pair of traces embedded therein and the first ground reference plane may have an opening corresponding to the pair of traces. The opening may have a width equal to or larger than a width of the pair of traces, which may be equal to widths of respective traces of the pair of traces and a gap between the pair of traces.

A transmission line includes a first structure including a first insulating substrate and a ground conductor on the first insulating substrate, a second structure including a second insulating substrate and a signal line, ground conductors, and interlayer connection conductors on or in the second insulating substrate, a third insulating substrate including openings, and metal bonding materials that bond the structure and the structure to each other with the third insulating substrate interposed therebetween. The first and second insulating substrates are stacked with the third insulating substrate interposed therebetween to define hollow portions. The signal line and the ground conductor partially face each other across the hollow portions in a bonding direction. The ground conductor includes openings in regions that overlap the signal line but do not overlap the hollow portions when looking in plan view in the bonding direction.