Aspects of the subject disclosure may include, for example, receiving, by a feed point of a dielectric antenna, electromagnetic waves from a dielectric core coupled to the feed point without an electrical return path, where at least a portion of the dielectric antenna comprises a conductive surface, directing, by the feed point, the electromagnetic waves to a proximal portion of the dielectric antenna, and radiating, via an aperture of the dielectric antenna, a wireless signal responsive to the electromagnetic waves being received at the aperture. Other embodiments are disclosed.

Aspects of the subject disclosure may include, for example, receiving, by a feed point of a dielectric antenna, electromagnetic waves from a dielectric core coupled to the feed point without an electrical return path, where at least a portion of the dielectric antenna comprises a conductive surface, directing, by the feed point, the electromagnetic waves to a proximal portion of the dielectric antenna, and radiating, via an aperture of the dielectric antenna, a wireless signal responsive to the electromagnetic waves being received at the aperture. Other embodiments are disclosed.

Waveguides and methods for manufacturing a waveguide that include forming a first channel in a first layer of dielectric material, the first channel comprising one or more walls; forming a second channel in a second layer of dielectric material, the second channel comprising one or more walls; depositing electrically conductive material on the one or more walls of the first channel; depositing electrically conductive material on the one or more walls of the second channel; arranging the first layer adjacent to the second layer to form a stack with the first channel axially aligned with and facing the second channel; and heating the stack so that the conductive material on the one or more walls of the first channel and the conductive material on the one or more walls of the second channel connect to form the waveguide.

Embodiments may relate to a semiconductor package that includes a package substrate coupled with a die. The package may further include a waveguide coupled with the first package substrate. The waveguide may include two or more layers of a dielectric material with a waveguide channel positioned between two layers of the two or more layers of the dielectric material. The waveguide channel may convey an electromagnetic signal with a frequency greater than 30 gigahertz (GHz). Other embodiments may be described or claimed.

Embodiments may relate to a semiconductor package that includes a package substrate coupled with a die. The package may further include a waveguide coupled with the first package substrate. The waveguide may include two or more layers of a dielectric material with a waveguide channel positioned between two layers of the two or more layers of the dielectric material. The waveguide channel may convey an electromagnetic signal with a frequency greater than 30 gigahertz (GHz). Other embodiments may be described or claimed.

Embodiments may relate an electronic device that includes a first platform and a second platform coupled with a chassis. The platforms may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first platform and the second platform such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.

Embodiments may relate an electronic device that includes a first platform and a second platform coupled with a chassis. The platforms may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first platform and the second platform such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.

A detection device for detecting an object under test includes a radar module, a waveguide element, and a first antenna element. The waveguide element is coupled to the radar module. The first antenna element is disposed on the waveguide element. The radar module generates a first electromagnetic incident wave. The first antenna element transmits the first electromagnetic incident wave toward the object. The first antenna element receives a first electromagnetic reflection wave from the object. The radar module processes the first electromagnetic reflection wave. The first electromagnetic incident wave and the first electromagnetic reflection wave are propagated through the waveguide element.

A detection device for detecting an object under test includes a radar module, a waveguide element, and a first antenna element. The waveguide element is coupled to the radar module. The first antenna element is disposed on the waveguide element. The radar module generates a first electromagnetic incident wave. The first antenna element transmits the first electromagnetic incident wave toward the object. The first antenna element receives a first electromagnetic reflection wave from the object. The radar module processes the first electromagnetic reflection wave. The first electromagnetic incident wave and the first electromagnetic reflection wave are propagated through the waveguide element.

A waveguide structure includes a first waveguide section mechanically and electrically connected by a fixed connector to a second waveguide section. The waveguide sections include a dielectric material with a ground layer and a conductor structure with a pair of elongate conductors. The fixed connector includes a dielectric material with a pair of contact pads insulated from a ground layer. The fixed connector is attached by its top side to the bottom sides of interface sections of the waveguides sections forming a ground contact. The interface sections each comprise an intermediate conductor from each of the elongate conductors at the top side to the bottom side of the dielectric material. The intermediate conductors are connected via the contact pads.