Provided herein are high energy ion beam generator systems and methods that provide low cost, high performance, robust, consistent, uniform, low gas consumption and high current/high-moderate voltage generation of neutrons and protons. Such systems and methods find use for the commercial-scale generation of neutrons and protons for a wide variety of research, medical, security, and industrial processes.

Signal conductor patterns (21, 31) are respectively formed on a first main surface (101) and a second main surface (102) of an insulating substrate (100). Ground conductor patterns (222, 322) are formed on the first main surface (101) and the second main surface (102). A first conductive member (41) is formed in the insulating substrate (100) and electrically connects the signal conductor patterns (21, 31) in the thickness direction. A second conductive member (42) is formed in the insulating substrate (100) and connected to the ground conductor patterns (222, 322). A dielectric member (43) is disposed between the first conductive member (41) and the second conductive member (42), is in contact with the first conductive member (41) and the second conductive member (42), and has a dielectric constant different from the dielectric constant of the insulating substrate (100).

Signal conductor patterns (21, 31) are respectively formed on a first main surface (101) and a second main surface (102) of an insulating substrate (100). Ground conductor patterns (222, 322) are formed on the first main surface (101) and the second main surface (102). A first conductive member (41) is formed in the insulating substrate (100) and electrically connects the signal conductor patterns (21, 31) in the thickness direction. A second conductive member (42) is formed in the insulating substrate (100) and connected to the ground conductor patterns (222, 322). A dielectric member (43) is disposed between the first conductive member (41) and the second conductive member (42), is in contact with the first conductive member (41) and the second conductive member (42), and has a dielectric constant different from the dielectric constant of the insulating substrate (100).

A waveguide structure includes a first waveguide section mechanically and electrically connected by a fixed connector to a second waveguide section. The waveguide sections include a dielectric material with a ground layer and a conductor structure with a pair of elongate conductors. The fixed connector includes a dielectric material with a pair of contact pads insulated from a ground layer. The fixed connector is attached by its top side to the bottom sides of interface sections of the waveguides sections forming a ground contact. The interface sections each comprise an intermediate conductor from each of the elongate conductors at the top side to the bottom side of the dielectric material. The intermediate conductors are connected via the contact pads.

A waveguide structure includes a first waveguide section mechanically and electrically connected by a fixed connector to a second waveguide section. The waveguide sections include a dielectric material with a ground layer and a conductor structure with a pair of elongate conductors. The fixed connector includes a dielectric material with a pair of contact pads insulated from a ground layer. The fixed connector is attached by its top side to the bottom sides of interface sections of the waveguides sections forming a ground contact. The interface sections each comprise an intermediate conductor from each of the elongate conductors at the top side to the bottom side of the dielectric material. The intermediate conductors are connected via the contact pads.

A waveguide structure includes a first waveguide section mechanically and electrically connected by a fixed connector to a second waveguide section. The waveguide sections include a dielectric material with a ground layer and a conductor structure with a pair of elongate conductors. The fixed connector includes a dielectric material with a pair of contact pads insulated from a ground layer. The fixed connector is attached by its top side to the bottom sides of interface sections of the waveguides sections forming a ground contact. The interface sections each comprise an intermediate conductor from each of the elongate conductors at the top side to the bottom side of the dielectric material. The intermediate conductors are connected via the contact pads.

A high-frequency line structure includes: a high-frequency line substrate; ground lead pins fixed to ground ends provided in a bottom surface of the high-frequency line substrate; and signal lead pins fixed to signal line ends provided in the bottom surface of the high-frequency line substrate, wherein the signal lead pins are arranged between the ground lead pins, the signal lead pins have a structure in which each of the signal lead pins springs up in a direction toward a side on which the high-frequency line substrate is arranged, from a horizontal plane to which bottom surfaces of the ground lead pins pertains, and spring-up heights in the structure in which the respective signal lead pins spring up are substantially the same.

A device includes a first substrate having a principal surface; a second substrate having a principal surface, in which the first substrate is bump-bonded to the second substrate such that the principal surface of the first substrate faces the principal surface of the second substrate; a circuit element having a microwave frequency resonance mode, in which a first portion of the circuit element is arranged on the principal surface of the first substrate and a second portion of the circuit element is arranged on the principal surface of the second substrate; and a first bump bond connected to the first portion of the circuit element and to the second portion of the circuit element, in which the first superconductor bump bond provides an electrical connection between the first portion and the second portion.

A waveguide flange adapter includes a plate; an aperture positioned through the plate; and a plurality of holes arranged in a pattern in the plate and around the aperture. The plate is configured to operatively connect a first waveguide to a second waveguide such that the first waveguide and the second waveguide have a different pattern of holes on the waveguide flanges to one another. The pattern of the plurality of holes may be configured to align with connecting holes in each of the first waveguide and the second waveguide. At least some of the plurality of holes may extend through an entire thickness of the plate. The plate may include electrically-conductive material. The size and shape of the aperture may be complementary to a size and shape of each of the first waveguide and the second waveguide. At least some of the plurality of holes may be tapped or untapped.

A waveguide flange adapter includes a plate; an aperture positioned through the plate; and a plurality of holes arranged in a pattern in the plate and around the aperture. The plate is configured to operatively connect a first waveguide to a second waveguide such that the first waveguide and the second waveguide have a different pattern of holes on the waveguide flanges to one another. The pattern of the plurality of holes may be configured to align with connecting holes in each of the first waveguide and the second waveguide. At least some of the plurality of holes may extend through an entire thickness of the plate. The plate may include electrically-conductive material. The size and shape of the aperture may be complementary to a size and shape of each of the first waveguide and the second waveguide. At least some of the plurality of holes may be tapped or untapped.